Inventor

DEVASENATHIPATHY SHANKAR

US21 patents

⚠️ This page may combine multiple inventors who share the name “DEVASENATHIPATHY SHANKAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DEVASENATHIPATHY SHANKAR

INTEL CORP

Thermal compression bonding process cooling manifold

Socket loading mechanism for passive or active socket and package cooling

Thermal assemblies for multi-chip packages

Thermal compression bonding process cooling manifold

High performance transient uniform cooling solution for thermal compression bonding process

Torque controlled driver apparatus and method

Cooling solution including microchannel arrays and methods of forming the same

STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die

Integrated circuit package socket housing to enhance package cooling

Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control

Sloped metal features for cooling hotspots in stacked-die packages

Enhanced base die heat path using through-silicon vias

Enhanced base die heat path using through-silicon vias

Enhanced base die heat path using through-silicon vias

Die back side structures for warpage control

Integrated heat spreader with multiple channels for multichip packages

Printed heat spreader structures and methods of providing same

Apparatus for inspection of a package assembly with a thermal solution

Liquid metal thermal interface material application

LI ZHIHUA

High performance transient uniform cooling solution for thermal compression bonding process

UNIV KEIO

Method and device for separating particle