Inventor

DAVID JEFFREY DRUE

US103 patents

⚠️ This page may combine multiple inventors who share the name “DAVID JEFFREY DRUE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DAVID JEFFREY DRUE

APPLIED MATERIALS INC

Spectrum based endpointing for chemical mechanical polishing

Substrate thickness measuring during polishing

Determination of position of sensor measurements during polishing

Spectra based endpointing for chemical mechanical polishing

Spectrum based endpointing for chemical mechanical polishing

Chemical mechanical polishing processes and components

Endpointing detection for chemical mechanical polishing based on spectrometry

Substrate thickness measuring during polishing

Substrate edge detection

Chemical mechanical polishing control system and method

Platen and head rotation rates for monitoring chemical mechanical polishing

Using optical metrology for within wafer feed forward process control

Polishing pad assembly with glass or crystalline window

Determining physical property of substrate

Polishing pad assembly with glass or crystalline window

Sealed polishing pad, system and methods

Sealed polishing pad methods

Chemical mechanical polishing apparatus with non-conductive elements

Grouping spectral data from polishing substrates

Reducing noise in spectral data from polishing substrates

Using spectra to determine polishing endpoints

Weighted regression of thickness maps from spectral data

Spectraphic monitoring based on pre-screening of theoretical library

Semi-quantitative thickness determination

Adjusting polishing rates by using spectrographic monitoring of a substrate during processing

Semi-quantitative thickness determination

High throughput measurement system

Methods and apparatus for generating a library of spectra

System with sealed polishing pad

Polishing with eddy current feed meaurement prior to deposition of conductive layer

Chemical mechanical polishing with multi-stage monitoring of metal clearing

Polishing pad assembly with glass or crystalline window

Determining physical property of substrate

Polishing system with optical head

Spectrum based endpointing for chemical mechanical polishing

Endpoint detection for chemical mechanical polishing based on spectrometry

DAVID JEFFREY DRUE

Using optical metrology for wafer to wafer feed back process control

Spectrographic monitoring of a substrate during processing using index values

Endpoint method using peak location of spectra contour plots versus time

Fitting of optical model to measured spectrum

Dynamically tracking spectrum features for endpoint detection

Method of controlling polishing

Gathering spectra from multiple optical heads

Endpoint method using peak location of modified spectra

Tracking spectrum features in two dimensions for endpoint detection

STREAM MOSAIC INC

Process control techniques for semiconductor manufacturing processes

Process control techniques for semiconductor manufacturing processes

PDF SOLUTIONS INC

Maintenance scheduling for semiconductor manufacturing equipment

Generating robust machine learning predictions for semiconductor manufacturing processes

QIAN JUN

Feedback for polishing rate correction in chemical mechanical polishing