Inventor

AKRAM SALMAN

US724 patents

Patents

50 patents

US7129114B2Oct 31, 2006

Methods relating to singulating semiconductor wafers and wafer scale assemblies

MICRON TECHNOLOGY INC123 citations99

US7091124B2Aug 15, 2006

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

MICRON TECHNOLOGY INC114 citations99

US6998344B2Feb 14, 2006

Method for fabricating semiconductor components by forming conductive members using solder

MICRON TECHNOLOGY INC101 citations99

US6953995B2Oct 11, 2005

Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom

MICRON TECHNOLOGY INC88 citations99

US6730543B2May 4, 2004

Methods for multiple die stack apparatus employing

MICRON TECHNOLOGY INC83 citations99

US6717245B1Apr 6, 2004

Chip scale packages performed by wafer level processing

MICRON TECHNOLOGY INC170 citations99

US6707141B2Mar 16, 2004

Multi-chip module substrate for use with leads-over chip type semiconductor devices

MICRON TECHNOLOGY INC94 citations99

US6696669B2Feb 24, 2004

Circuit and method for heating an adhesive to package or rework a semiconductor die

MICRON TECHNOLOGY INC126 citations99

US6634100B2Oct 21, 2003

Interposer and methods for fabricating same

MICRON TECHNOLOGY INC98 citations99

US6613662B2Sep 2, 2003

Method for making projected contact structures for engaging bumped semiconductor devices

MICRON TECHNOLOGY INC128 citations99

US6583503B2Jun 24, 2003

Semiconductor package with stacked substrates and multiple semiconductor dice

MICRON TECHNOLOGY INC275 citations99

US6578458B1Jun 17, 2003

Method for sawing wafers employing multiple indexing techniques for multiple die dimensions

MICRON TECHNOLOGY INC106 citations99

US6563712B2May 13, 2003

Heak sink chip package

MICRON TECHNOLOGY INC154 citations99

US6544880B1Apr 8, 2003

Method of improving copper interconnects of semiconductor devices for bonding

MICRON TECHNOLOGY INC188 citations99

US6544821B2Apr 8, 2003

Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed

MICRON TECHNOLOGY INC125 citations99

US6529027B1Mar 4, 2003

Interposer and methods for fabricating same

MICRON TECHNOLOGY INC118 citations99

US6462423B1Oct 8, 2002

Flip-chip with matched lines and ground plane

MICRON TECHNOLOGY INC126 citations99

US6437591B1Aug 20, 2002

Test interconnect for bumped semiconductor components and method of fabrication

MICRON TECHNOLOGY INC132 citations99

US6400172B1Jun 4, 2002

Semiconductor components having lasered machined conductive vias

MICRON TECHNOLOGY INC222 citations99

US6359456B1Mar 19, 2002

Probe card and test system for semiconductor wafers

MICRON TECHNOLOGY INC149 citations99

US6351028B1Feb 26, 2002

Multiple die stack apparatus employing T-shaped interposer elements

MICRON TECHNOLOGY INC257 citations99

US6326698B1Dec 4, 2001

Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices

MICRON TECHNOLOGY INC438 citations99

US6310484B1Oct 30, 2001

Semiconductor test interconnect with variable flexure contacts

MICRON TECHNOLOGY INC147 citations99

US6297547B1Oct 2, 2001

Mounting multiple semiconductor dies in a package

MICRON TECHNOLOGY INC264 citations99

US6294837B1Sep 25, 2001

Semiconductor interconnect having laser machined contacts

MICRON TECHNOLOGY INC336 citations99

US6275052B1Aug 14, 2001

Probe card and testing method for semiconductor wafers

MICRON TECHNOLOGY INC118 citations99

US6261865B1Jul 17, 2001

Multi chip semiconductor package and method of construction

MICRON TECHNOLOGY INC299 citations99

US6252308B1Jun 26, 2001

Packaged die PCB with heat sink encapsulant

MICRON TECHNOLOGY INC120 citations99

US6246245B1Jun 12, 2001

Probe card, test method and test system for semiconductor wafers

MICRON TECHNOLOGY INC130 citations99

US6235554B1May 22, 2001

Method for fabricating stackable chip scale semiconductor package

MICRON TECHNOLOGY INC647 citations99

US6228687B1May 8, 2001

Wafer-level package and methods of fabricating

MICRON TECHNOLOGY INC355 citations99

US6222265B1Apr 24, 2001

Method of constructing stacked packages

MICRON TECHNOLOGY INC201 citations99

US6214641B1Apr 10, 2001

Method of fabricating a multi-chip module

MICRON TECHNOLOGY INC227 citations99

US6214716B1Apr 10, 2001

Semiconductor substrate-based BGA interconnection and methods of farication same

MICRON TECHNOLOGY INC158 citations99

US6188232B1Feb 13, 2001

Temporary package, system, and method for testing semiconductor dice and chip scale packages

MICRON TECHNOLOGY INC229 citations99

US6181144B1Jan 30, 2001

Semiconductor probe card having resistance measuring circuitry and method fabrication

MICRON TECHNOLOGY INC308 citations99

US6175149B1Jan 16, 2001

Mounting multiple semiconductor dies in a package

MICRON TECHNOLOGY INC250 citations99

US6169021B1Jan 2, 2001

Method of making a metallized recess in a substrate

MICRON TECHNOLOGY INC253 citations99

US6165814ADec 26, 2000

Thin film capacitor coupons for memory modules and multi-chip modules

MICRON TECHNOLOGY INC138 citations99

US6124634ASep 26, 2000

Micromachined chip scale package

MICRON TECHNOLOGY INC328 citations99

US6122171ASep 19, 2000

Heat sink chip package and method of making

MICRON TECHNOLOGY INC311 citations99

US6119255ASep 12, 2000

Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit

MICRON TECHNOLOGY INC110 citations99

US6114240ASep 5, 2000

Method for fabricating semiconductor components using focused laser beam

MICRON TECHNOLOGY INC522 citations99

US6107109AAug 22, 2000

Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate

MICRON TECHNOLOGY INC403 citations99

US6094058AJul 25, 2000

Temporary semiconductor package having dense array external contacts

MICRON TECHNOLOGY INC173 citations99

US6089920AJul 18, 2000

Modular die sockets with flexible interconnects for packaging bare semiconductor die

MICRON TECHNOLOGY INC205 citations99

US6075288AJun 13, 2000

Semiconductor package having interlocking heat sinks and method of fabrication

MICRON TECHNOLOGY INC172 citations99

Showing the top 50 of 724 patents by PatentIndex Score.

AKRAM SALMAN

Patents

Methods relating to singulating semiconductor wafers and wafer scale assemblies

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Method for fabricating semiconductor components by forming conductive members using solder

Hermetic chip in wafer form

Memory modules including capacity for additional memory

Stacked semiconductor package having laser machined contacts

Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom

Methods for multiple die stack apparatus employing

Chip scale packages performed by wafer level processing

Multi-chip module substrate for use with leads-over chip type semiconductor devices

Circuit and method for heating an adhesive to package or rework a semiconductor die

Interposer and methods for fabricating same

Method for making projected contact structures for engaging bumped semiconductor devices

Semiconductor package with stacked substrates and multiple semiconductor dice

Method for sawing wafers employing multiple indexing techniques for multiple die dimensions

Heak sink chip package

Method of improving copper interconnects of semiconductor devices for bonding

Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed

Interposer and methods for fabricating same

Flip-chip with matched lines and ground plane

Test interconnect for bumped semiconductor components and method of fabrication

Semiconductor components having lasered machined conductive vias

Probe card and test system for semiconductor wafers

Multiple die stack apparatus employing T-shaped interposer elements

Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices

Semiconductor test interconnect with variable flexure contacts

Mounting multiple semiconductor dies in a package

Semiconductor interconnect having laser machined contacts

Probe card and testing method for semiconductor wafers

Multi chip semiconductor package and method of construction

Packaged die PCB with heat sink encapsulant

Probe card, test method and test system for semiconductor wafers

Method for fabricating stackable chip scale semiconductor package

Wafer-level package and methods of fabricating

Method of constructing stacked packages

Method of fabricating a multi-chip module

Semiconductor substrate-based BGA interconnection and methods of farication same

Temporary package, system, and method for testing semiconductor dice and chip scale packages

Semiconductor probe card having resistance measuring circuitry and method fabrication

Mounting multiple semiconductor dies in a package

Method of making a metallized recess in a substrate

Thin film capacitor coupons for memory modules and multi-chip modules

Micromachined chip scale package

Heat sink chip package and method of making

Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit

Method for fabricating semiconductor components using focused laser beam

Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate

Temporary semiconductor package having dense array external contacts

Modular die sockets with flexible interconnects for packaging bare semiconductor die

Semiconductor package having interlocking heat sinks and method of fabrication