P

Inventor

BIRANG MANOOCHER

US167 patents
⚠️ This page may combine multiple inventors who share the name “BIRANG MANOOCHER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

49 patents
US6537133B1Mar 25, 2003

Method for in-situ endpoint detection for chemical mechanical polishing operations

APPLIED MATERIALS INC161 citations99
US6280290B1Aug 28, 2001

Method of forming a transparent window in a polishing pad

APPLIED MATERIALS INC165 citations99
US6244935B1Jun 12, 2001

Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet

APPLIED MATERIALS INC178 citations99
US6183354B1Feb 6, 2001

Carrier head with a flexible membrane for a chemical mechanical polishing system

APPLIED MATERIALS INC276 citations99
US6179709B1Jan 30, 2001

In-situ monitoring of linear substrate polishing operations

APPLIED MATERIALS INC181 citations99
US6159079ADec 12, 2000

Carrier head for chemical mechanical polishing a substrate

APPLIED MATERIALS INC152 citations99
US6045439AApr 4, 2000

Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus

APPLIED MATERIALS INC228 citations99
US5893796AApr 13, 1999

Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus

APPLIED MATERIALS INC739 citations99
US5846882ADec 8, 1998

Endpoint detector for a chemical mechanical polishing system

APPLIED MATERIALS INC152 citations99
US5745331AApr 28, 1998

Electrostatic chuck with conformal insulator film

APPLIED MATERIALS INC166 citations99
US7097537B1Aug 29, 2006

Determination of position of sensor measurements during polishing

APPLIED MATERIALS INC81 citations98
US6776692B1Aug 17, 2004

Closed-loop control of wafer polishing in a chemical mechanical polishing system

APPLIED MATERIALS INC92 citations98
US6719818B1Apr 13, 2004

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

APPLIED MATERIALS INC92 citations98
US6399501B2Jun 4, 2002

Method and apparatus for detecting polishing endpoint with optical monitoring

APPLIED MATERIALS INC93 citations98
US6296548B1Oct 2, 2001

Method and apparatus for optical monitoring in chemical mechanical polishing

APPLIED MATERIALS INC132 citations98
US6247998B1Jun 19, 2001

Method and apparatus for determining substrate layer thickness during chemical mechanical polishing

APPLIED MATERIALS INC124 citations98
US5964643AOct 12, 1999

Apparatus and method for in-situ monitoring of chemical mechanical polishing operations

APPLIED MATERIALS INC458 citations98
US5743784AApr 28, 1998

Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process

APPLIED MATERIALS INC122 citations98
US5708506AJan 13, 1998

Apparatus and method for detecting surface roughness in a chemical polishing pad conditioning process

APPLIED MATERIALS INC131 citations98
US6939198B1Sep 6, 2005

Polishing system with in-line and in-situ metrology

APPLIED MATERIALS INC70 citations97
US6413873B1Jul 2, 2002

System for chemical mechanical planarization

APPLIED MATERIALS INC85 citations97
US7112960B2Sep 26, 2006

Eddy current system for in-situ profile measurement

APPLIED MATERIALS INC87 citations96
US6975107B2Dec 13, 2005

Eddy current sensing of metal removal for chemical mechanical polishing

APPLIED MATERIALS INC35 citations96
US6966816B2Nov 22, 2005

Integrated endpoint detection system with optical and eddy current monitoring

APPLIED MATERIALS INC45 citations96
US6924641B1Aug 2, 2005

Method and apparatus for monitoring a metal layer during chemical mechanical polishing

APPLIED MATERIALS INC63 citations96
US6910944B2Jun 28, 2005

Method of forming a transparent window in a polishing pad

APPLIED MATERIALS INC28 citations96
US6876454B1Apr 5, 2005

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

APPLIED MATERIALS INC44 citations96
US6796880B2Sep 28, 2004

Linear polishing sheet with window

APPLIED MATERIALS INC42 citations96
US6676717B1Jan 13, 2004

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

APPLIED MATERIALS INC58 citations96
US6585563B1Jul 1, 2003

In-situ monitoring of linear substrate polishing operations

APPLIED MATERIALS INC35 citations96
US6390904B1May 21, 2002

Retainers and non-abrasive liners used in chemical mechanical polishing

APPLIED MATERIALS INC103 citations96
US6383058B1May 7, 2002

Adaptive endpoint detection for chemical mechanical polishing

APPLIED MATERIALS INC63 citations96
US6348124B1Feb 19, 2002

Delivery of polishing agents in a wafer processing system

APPLIED MATERIALS INC89 citations96
US6159087ADec 12, 2000

End effector for pad conditioning

APPLIED MATERIALS INC76 citations96
US6146259ANov 14, 2000

Carrier head with local pressure control for a chemical mechanical polishing apparatus

APPLIED MATERIALS INC81 citations96
US5883778AMar 16, 1999

Electrostatic chuck with fluid flow regulator

APPLIED MATERIALS INC68 citations96
US5753132AMay 19, 1998

Method of making electrostatic chuck with conformal insulator film

APPLIED MATERIALS INC78 citations96
US5491603AFeb 13, 1996

Method of determining a dechucking voltage which nullifies a residual electrostatic force between an electrostatic chuck and a wafer

APPLIED MATERIALS INC77 citations96
US5612850AMar 18, 1997

Releasing a workpiece from an electrostatic chuck

APPLIED MATERIALS INC52 citations95
US5459632AOct 17, 1995

Releasing a workpiece from an electrostatic chuck

APPLIED MATERIALS INC96 citations95
US5151584ASep 29, 1992

Method and apparatus for endpoint detection in a semiconductor wafer etching system

APPLIED MATERIALS INC54 citations95
US6557248B1May 6, 2003

Method of fabricating an electrostatic chuck

APPLIED MATERIALS INC47 citations94
US6390908B1May 21, 2002

Determining when to replace a retaining ring used in substrate polishing operations

APPLIED MATERIALS INC77 citations94
US6023405AFeb 8, 2000

Electrostatic chuck with improved erosion resistance

APPLIED MATERIALS INC56 citations94
US5822171AOct 13, 1998

Electrostatic chuck with improved erosion resistance

APPLIED MATERIALS INC74 citations94
US7374477B2May 20, 2008

Polishing pads useful for endpoint detection in chemical mechanical polishing

APPLIED MATERIALS INC17 citations93
US7229340B2Jun 12, 2007

Monitoring a metal layer during chemical mechanical polishing

APPLIED MATERIALS INC15 citations93
US7153185B1Dec 26, 2006

Substrate edge detection

APPLIED MATERIALS INC35 citations93
US7118457B2Oct 10, 2006

Method of forming a polishing pad for endpoint detection

APPLIED MATERIALS INC19 citations93

KATEEVA INC

1 patent

Showing the top 50 of 167 patents by PatentIndex Score.