Inventor
BIRANG MANOOCHER
US167 patents
⚠️ This page may combine multiple inventors who share the name “BIRANG MANOOCHER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
49 patentsUS6537133B1Mar 25, 2003
Method for in-situ endpoint detection for chemical mechanical polishing operations
APPLIED MATERIALS INC161 citations99
US6280290B1Aug 28, 2001
Method of forming a transparent window in a polishing pad
APPLIED MATERIALS INC165 citations99
US6244935B1Jun 12, 2001
Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
APPLIED MATERIALS INC178 citations99
US6183354B1Feb 6, 2001
Carrier head with a flexible membrane for a chemical mechanical polishing system
APPLIED MATERIALS INC276 citations99
US6179709B1Jan 30, 2001
In-situ monitoring of linear substrate polishing operations
APPLIED MATERIALS INC181 citations99
US6159079ADec 12, 2000
Carrier head for chemical mechanical polishing a substrate
APPLIED MATERIALS INC152 citations99
US6045439AApr 4, 2000
Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC228 citations99
US5893796AApr 13, 1999
Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC739 citations99
US5846882ADec 8, 1998
Endpoint detector for a chemical mechanical polishing system
APPLIED MATERIALS INC152 citations99
US5745331AApr 28, 1998
Electrostatic chuck with conformal insulator film
APPLIED MATERIALS INC166 citations99
US7097537B1Aug 29, 2006
Determination of position of sensor measurements during polishing
APPLIED MATERIALS INC81 citations98
US6776692B1Aug 17, 2004
Closed-loop control of wafer polishing in a chemical mechanical polishing system
APPLIED MATERIALS INC92 citations98
US6719818B1Apr 13, 2004
Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
APPLIED MATERIALS INC92 citations98
US6399501B2Jun 4, 2002
Method and apparatus for detecting polishing endpoint with optical monitoring
APPLIED MATERIALS INC93 citations98
US6296548B1Oct 2, 2001
Method and apparatus for optical monitoring in chemical mechanical polishing
APPLIED MATERIALS INC132 citations98
US6247998B1Jun 19, 2001
Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC124 citations98
US5964643AOct 12, 1999
Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
APPLIED MATERIALS INC458 citations98
US5743784AApr 28, 1998
Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process
APPLIED MATERIALS INC122 citations98
US5708506AJan 13, 1998
Apparatus and method for detecting surface roughness in a chemical polishing pad conditioning process
APPLIED MATERIALS INC131 citations98
US6939198B1Sep 6, 2005
Polishing system with in-line and in-situ metrology
APPLIED MATERIALS INC70 citations97
US6413873B1Jul 2, 2002
System for chemical mechanical planarization
APPLIED MATERIALS INC85 citations97
US7112960B2Sep 26, 2006
Eddy current system for in-situ profile measurement
APPLIED MATERIALS INC87 citations96
US6975107B2Dec 13, 2005
Eddy current sensing of metal removal for chemical mechanical polishing
APPLIED MATERIALS INC35 citations96
US6966816B2Nov 22, 2005
Integrated endpoint detection system with optical and eddy current monitoring
APPLIED MATERIALS INC45 citations96
US6924641B1Aug 2, 2005
Method and apparatus for monitoring a metal layer during chemical mechanical polishing
APPLIED MATERIALS INC63 citations96
US6910944B2Jun 28, 2005
Method of forming a transparent window in a polishing pad
APPLIED MATERIALS INC28 citations96
US6876454B1Apr 5, 2005
Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
APPLIED MATERIALS INC44 citations96
US6796880B2Sep 28, 2004
Linear polishing sheet with window
APPLIED MATERIALS INC42 citations96
US6676717B1Jan 13, 2004
Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
APPLIED MATERIALS INC58 citations96
US6585563B1Jul 1, 2003
In-situ monitoring of linear substrate polishing operations
APPLIED MATERIALS INC35 citations96
US6390904B1May 21, 2002
Retainers and non-abrasive liners used in chemical mechanical polishing
APPLIED MATERIALS INC103 citations96
US6383058B1May 7, 2002
Adaptive endpoint detection for chemical mechanical polishing
APPLIED MATERIALS INC63 citations96
US6348124B1Feb 19, 2002
Delivery of polishing agents in a wafer processing system
APPLIED MATERIALS INC89 citations96
US6159087ADec 12, 2000
End effector for pad conditioning
APPLIED MATERIALS INC76 citations96
US6146259ANov 14, 2000
Carrier head with local pressure control for a chemical mechanical polishing apparatus
APPLIED MATERIALS INC81 citations96
US5883778AMar 16, 1999
Electrostatic chuck with fluid flow regulator
APPLIED MATERIALS INC68 citations96
US5753132AMay 19, 1998
Method of making electrostatic chuck with conformal insulator film
APPLIED MATERIALS INC78 citations96
US5491603AFeb 13, 1996
Method of determining a dechucking voltage which nullifies a residual electrostatic force between an electrostatic chuck and a wafer
APPLIED MATERIALS INC77 citations96
US5612850AMar 18, 1997
Releasing a workpiece from an electrostatic chuck
APPLIED MATERIALS INC52 citations95
US5459632AOct 17, 1995
Releasing a workpiece from an electrostatic chuck
APPLIED MATERIALS INC96 citations95
US5151584ASep 29, 1992
Method and apparatus for endpoint detection in a semiconductor wafer etching system
APPLIED MATERIALS INC54 citations95
US6557248B1May 6, 2003
Method of fabricating an electrostatic chuck
APPLIED MATERIALS INC47 citations94
US6390908B1May 21, 2002
Determining when to replace a retaining ring used in substrate polishing operations
APPLIED MATERIALS INC77 citations94
US6023405AFeb 8, 2000
Electrostatic chuck with improved erosion resistance
APPLIED MATERIALS INC56 citations94
US5822171AOct 13, 1998
Electrostatic chuck with improved erosion resistance
APPLIED MATERIALS INC74 citations94
US7374477B2May 20, 2008
Polishing pads useful for endpoint detection in chemical mechanical polishing
APPLIED MATERIALS INC17 citations93
US7229340B2Jun 12, 2007
Monitoring a metal layer during chemical mechanical polishing
APPLIED MATERIALS INC15 citations93
US7153185B1Dec 26, 2006
Substrate edge detection
APPLIED MATERIALS INC35 citations93
US7118457B2Oct 10, 2006
Method of forming a polishing pad for endpoint detection
APPLIED MATERIALS INC19 citations93
KATEEVA INC
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