Inventor

SWEDEK BOGUSLAW A

US157 patents

⚠️ This page may combine multiple inventors who share the name “SWEDEK BOGUSLAW A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SWEDEK BOGUSLAW A

APPLIED MATERIALS INC

Substrate thickness measuring during polishing

Determination of position of sensor measurements during polishing

Polishing system with in-line and in-situ metrology

Spectra based endpointing for chemical mechanical polishing

Eddy current system for in-situ profile measurement

Integrated endpoint detection system with optical and eddy current monitoring

Determination of gain for eddy current sensor

Endpointing detection for chemical mechanical polishing based on spectrometry

Substrate thickness measuring during polishing

Polishing pads useful for endpoint detection in chemical mechanical polishing

Metrology for chemical mechanical polishing

Substrate edge detection

Method of forming a polishing pad for endpoint detection

Chemical mechanical polishing control system and method

Signal improvement in eddy current sensing

Data processing for monitoring chemical mechanical polishing

Substrate monitoring during chemical mechanical polishing

Combined eddy current sensing and optical monitoring for chemical mechanical polishing

System and method for in-line metal profile measurement

Polishing pad with transparent window

Using optical metrology for within wafer feed forward process control

Reducing polishing pad deformation

Polishing endpoint detection system and method using friction sensor

Determining physical property of substrate

Polishing system with in-line and in-situ metrology

Feedback controlled polishing processes

Polishing system with in-line and in-situ metrology

Feedback controlled polishing processes

Method and apparatus of eddy current monitoring for chemical mechanical polishing

Polishing pad with window

Optical monitoring in a two-step chemical mechanical polishing process

Optical monitoring in a two-step chemical mechanical polishing process

Chemical mechanical polishing apparatus with non-conductive elements

Polishing apparatus using neural network for monitoring

Grouping spectral data from polishing substrates

Adjusting eddy current measurements

Reducing noise in spectral data from polishing substrates

In-situ monitoring system with monitoring of elongated region

Thin polishing pad with window and molding process

Using spectra to determine polishing endpoints

Reflectivity measurements during polishing using a camera

Weighted regression of thickness maps from spectral data

BENVEGNU DOMINIC J

Thin polishing pad with window and molding process

Polishing pad with partially recessed window

Methods and apparatus for measuring substrate edge thickness during polishing

DAVID JEFFREY DRUE

Using optical metrology for wafer to wafer feed back process control

Spectrographic monitoring of a substrate during processing using index values

Endpoint method using peak location of spectra contour plots versus time

IRAVANI HASSAN G

Eddy current sensor with enhanced edge resolution

SWEDEK BOGUSLAW A

Spectra based endpointing for chemical mechanical polishing