P

Inventor

MIYAZAWA AKIHIRO

JP6 patents
⚠️ This page may combine multiple inventors who share the name “MIYAZAWA AKIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DOWA ELECTRONICS MATERIALS CO LTD

3 patents
US10328534B2Jun 25, 2019

Bonding material and bonding method using same

DOWA ELECTRONICS MATERIALS CO LTD2 citations68
US10090275B2Oct 2, 2018

Bonding method using bonding material

DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US10008471B2Jun 26, 2018

Bonding material and bonding method using the same

DOWA ELECTRONICS MATERIALS CO LTD0 citations48

ENDOH KEIICHI

2 patents
US8641929B2Feb 4, 2014

Low-temperature-sinterable bonding material, and bonding method using the bonding material

ENDOH KEIICHI9 citations79
US9240256B2Jan 19, 2016

Bonding material and bonding method using the same

ENDOH KEIICHI1 citations58

SONY SEMICONDUCTOR SOLUTIONS CORP

1 patent
US12598389B2Apr 7, 2026

Imaging device, sensor chip, and processing circuit

SONY SEMICONDUCTOR SOLUTIONS CORP0 citations50