Inventor

HEMBREE DAVID R

US361 patents

Patents

50 patents

US7919846B2Apr 5, 2011

Method for fabricating stacked semiconductor components with through wire interconnects

MICRON TECHNOLOGY INC133 citations99

US7659612B2Feb 9, 2010

Semiconductor components having encapsulated through wire interconnects (TWI)

MICRON TECHNOLOGY INC75 citations99

US7498675B2Mar 3, 2009

Semiconductor component having plate, stacked dice and conductive vias

MICRON TECHNOLOGY INC292 citations99

US7393770B2Jul 1, 2008

Backside method for fabricating semiconductor components with conductive interconnects

MICRON TECHNOLOGY INC130 citations99

US7371676B2May 13, 2008

Method for fabricating semiconductor components with through wire interconnects

MICRON TECHNOLOGY INC171 citations99

US7307348B2Dec 11, 2007

Semiconductor components having through wire interconnects (TWI)

MICRON TECHNOLOGY INC91 citations99

US7060526B2Jun 13, 2006

Wafer level methods for fabricating multi-dice chip scale semiconductor components

MICRON TECHNOLOGY INC96 citations99

US6903443B2Jun 7, 2005

Semiconductor component and interconnect having conductive members and contacts on opposing sides

MICRON TECHNOLOGY INC246 citations99

US6841883B1Jan 11, 2005

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

MICRON TECHNOLOGY INC659 citations99

US6841868B2Jan 11, 2005

Memory modules including capacity for additional memory

MICRON TECHNOLOGY INC83 citations99

US6784113B2Aug 31, 2004

Chip on board and heat sink attachment methods

MICRON TECHNOLOGY INC74 citations99

US6774651B1Aug 10, 2004

Method for aligning and connecting semiconductor components to substrates

MICRON TECHNOLOGY INC99 citations99

US6696669B2Feb 24, 2004

Circuit and method for heating an adhesive to package or rework a semiconductor die

MICRON TECHNOLOGY INC126 citations99

US6620731B1Sep 16, 2003

Method for fabricating semiconductor components and interconnects with contacts on opposing sides

MICRON TECHNOLOGY INC293 citations99

US6578458B1Jun 17, 2003

Method for sawing wafers employing multiple indexing techniques for multiple die dimensions

MICRON TECHNOLOGY INC106 citations99

US6451709B1Sep 17, 2002

Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package

MICRON TECHNOLOGY INC152 citations99

US6359456B1Mar 19, 2002

Probe card and test system for semiconductor wafers

MICRON TECHNOLOGY INC149 citations99

US6300782B1Oct 9, 2001

System for testing semiconductor components having flexible interconnect

MICRON TECHNOLOGY INC111 citations99

US6275052B1Aug 14, 2001

Probe card and testing method for semiconductor wafers

MICRON TECHNOLOGY INC118 citations99

US6267650B1Jul 31, 2001

Apparatus and methods for substantial planarization of solder bumps

MICRON TECHNOLOGY INC160 citations99

US6263566B1Jul 24, 2001

Flexible semiconductor interconnect fabricated by backslide thinning

MICRON TECHNOLOGY INC141 citations99

US6246245B1Jun 12, 2001

Probe card, test method and test system for semiconductor wafers

MICRON TECHNOLOGY INC130 citations99

US6242932B1Jun 5, 2001

Interposer for semiconductor components having contact balls

MICRON TECHNOLOGY INC233 citations99

US6208156B1Mar 27, 2001

Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems

MICRON TECHNOLOGY INC137 citations99

US6181144B1Jan 30, 2001

Semiconductor probe card having resistance measuring circuitry and method fabrication

MICRON TECHNOLOGY INC308 citations99

US6124634ASep 26, 2000

Micromachined chip scale package

MICRON TECHNOLOGY INC328 citations99

US6117797ASep 12, 2000

Attachment method for heat sinks and devices involving removal of misplaced encapsulant

MICRON TECHNOLOGY INC137 citations99

US6094058AJul 25, 2000

Temporary semiconductor package having dense array external contacts

MICRON TECHNOLOGY INC173 citations99

US6078186AJun 20, 2000

Force applying probe card and test system for semiconductor wafers

MICRON TECHNOLOGY INC197 citations99

US6072236AJun 6, 2000

Micromachined chip scale package

MICRON TECHNOLOGY INC520 citations99

US6060891AMay 9, 2000

Probe card for semiconductor wafers and method and system for testing wafers

MICRON TECHNOLOGY INC218 citations99

US6040702AMar 21, 2000

Carrier and system for testing bumped semiconductor components

MICRON TECHNOLOGY INC151 citations99

US6025728AFeb 15, 2000

Semiconductor package with wire bond protective member

MICRON TECHNOLOGY INC230 citations99

US6016060AJan 18, 2000

Method, apparatus and system for testing bumped semiconductor components

MICRON TECHNOLOGY INC132 citations99

US5952840ASep 14, 1999

Apparatus for testing semiconductor wafers

MICRON TECHNOLOGY INC128 citations99

US5938956AAug 17, 1999

Circuit and method for heating an adhesive to package or rework a semiconductor die

MICRON TECHNOLOGY INC229 citations99

US5931685AAug 3, 1999

Interconnect for making temporary electrical connections with bumped semiconductor components

MICRON TECHNOLOGY INC158 citations99

US5915977AJun 29, 1999

System and interconnect for making temporary electrical connections with bumped semiconductor components

MICRON TECHNOLOGY INC164 citations99

US5893726AApr 13, 1999

Semiconductor package with pre-fabricated cover and method of fabrication

MICRON TECHNOLOGY INC174 citations99

US5878485AMar 9, 1999

Method for fabricating a carrier for testing unpackaged semiconductor dice

MICRON TECHNOLOGY INC128 citations99

US5869974AFeb 9, 1999

Micromachined probe card having compliant contact members for testing semiconductor wafers

MICRON TECHNOLOGY INC259 citations99

US5838161ANov 17, 1998

Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect

MICRON TECHNOLOGY INC143 citations99

US5815000ASep 29, 1998

Method for testing semiconductor dice with conventionally sized temporary packages

MICRON TECHNOLOGY INC271 citations99

US5783461AJul 21, 1998

Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication

MICRON TECHNOLOGY INC191 citations99

US5776824AJul 7, 1998

Method for producing laminated film/metal structures for known good die ("KG") applications

MICRON TECHNOLOGY INC196 citations99

US5607818AMar 4, 1997

Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition

MICRON TECHNOLOGY INC161 citations99

US5541525AJul 30, 1996

Carrier for testing an unpackaged semiconductor die

MICRON TECHNOLOGY INC276 citations99

Showing the top 50 of 361 patents by PatentIndex Score.

HEMBREE DAVID R

Patents

Stacked semiconductor component having through wire interconnect

System for fabricating semiconductor components with through wire interconnects

Semiconductor components with through wire interconnects

Method for fabricating stacked semiconductor components with through wire interconnects

Semiconductor components having encapsulated through wire interconnects (TWI)

Semiconductor component having plate, stacked dice and conductive vias

Backside method for fabricating semiconductor components with conductive interconnects

Method for fabricating semiconductor components with through wire interconnects

Semiconductor components having through wire interconnects (TWI)

Wafer level methods for fabricating multi-dice chip scale semiconductor components

Semiconductor component and interconnect having conductive members and contacts on opposing sides

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Memory modules including capacity for additional memory

Chip on board and heat sink attachment methods

Method for aligning and connecting semiconductor components to substrates

Circuit and method for heating an adhesive to package or rework a semiconductor die

Method for fabricating semiconductor components and interconnects with contacts on opposing sides

Method for sawing wafers employing multiple indexing techniques for multiple die dimensions

Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package

Probe card and test system for semiconductor wafers

System for testing semiconductor components having flexible interconnect

Probe card and testing method for semiconductor wafers

Apparatus and methods for substantial planarization of solder bumps

Flexible semiconductor interconnect fabricated by backslide thinning

Probe card, test method and test system for semiconductor wafers

Interposer for semiconductor components having contact balls

Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems

Semiconductor probe card having resistance measuring circuitry and method fabrication

Micromachined chip scale package

Attachment method for heat sinks and devices involving removal of misplaced encapsulant

Temporary semiconductor package having dense array external contacts

Force applying probe card and test system for semiconductor wafers

Micromachined chip scale package

Probe card for semiconductor wafers and method and system for testing wafers

Carrier and system for testing bumped semiconductor components

Semiconductor package with wire bond protective member

Method, apparatus and system for testing bumped semiconductor components

Apparatus for testing semiconductor wafers

Circuit and method for heating an adhesive to package or rework a semiconductor die

Interconnect for making temporary electrical connections with bumped semiconductor components

System and interconnect for making temporary electrical connections with bumped semiconductor components

Semiconductor package with pre-fabricated cover and method of fabrication

Method for fabricating a carrier for testing unpackaged semiconductor dice

Micromachined probe card having compliant contact members for testing semiconductor wafers

Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect

Method for testing semiconductor dice with conventionally sized temporary packages

Temporary semiconductor package having hard-metal, dense-array ball contacts and method of fabrication

Method for producing laminated film/metal structures for known good die (&#34;KG&#34;) applications

Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition

Carrier for testing an unpackaged semiconductor die

Method for producing laminated film/metal structures for known good die ("KG") applications