Inventor
LI CHIEN-TSAI
TW5 patents
Patents
5 patentsUS11013103B2May 18, 2021
Method for forming circuit board stacked structure
UNIMICRON TECHNOLOGY CORP0 citations60
US10178755B2Jan 8, 2019
Circuit board stacked structure and method for forming the same
UNIMICRON TECHNOLOGY CORP0 citations49
US10159151B1Dec 18, 2018
Chip package circuit board module
UNIMICRON TECHNOLOGY CORP1 citations48
US10070536B2Sep 4, 2018
Manufacturing method of circuit board structure
UNIMICRON TECHNOLOGY CORP0 citations37
US9917046B2Mar 13, 2018
Manufacturing method of a circuit board having a glass film
UNIMICRON TECHNOLOGY CORP0 citations37