P

Inventor

YANG LITAO

US27 patents
⚠️ This page may combine multiple inventors who share the name “YANG LITAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

21 patents
US11164872B1Nov 2, 2021

Underbody contact to horizontal access devices for vertical three-dimensional (3D) memory

MICRON TECHNOLOGY INC14 citations86
US11600535B2Mar 7, 2023

Integrated assemblies having conductive material along three of four sides around active regions, and methods of forming integrated assemblies

MICRON TECHNOLOGY INC4 citations74
US11641732B2May 2, 2023

Self-aligned etch back for vertical three dimensional (3D) memory

MICRON TECHNOLOGY INC2 citations73
US11538809B2Dec 27, 2022

Metal insulator semiconductor (MIS) contact in three dimensional (3D) vertical memory

MICRON TECHNOLOGY INC3 citations73
US11495600B2Nov 8, 2022

Vertical three-dimensional memory with vertical channel

MICRON TECHNOLOGY INC3 citations73
US11411118B2Aug 9, 2022

Integrated assemblies

MICRON TECHNOLOGY INC3 citations73
US11127747B2Sep 21, 2021

Transistors including two-dimensional materials

MICRON TECHNOLOGY INC1 citations73
US10923480B2Feb 16, 2021

Capacitance reduction in a semiconductor device

MICRON TECHNOLOGY INC2 citations73
US11069687B2Jul 20, 2021

Integrated assemblies having shield lines between digit lines, and methods of forming integrated assemblies

MICRON TECHNOLOGY INC3 citations72
US12526978B2Jan 13, 2026

Vertical three-dimensional memory with vertical channel

MICRON TECHNOLOGY INC0 citations62
US11943919B2Mar 26, 2024

Microelectronic devices including two-dimensional materials, and related memory devices and electronic systems

MICRON TECHNOLOGY INC0 citations62
US11935960B2Mar 19, 2024

Integrated assemblies

MICRON TECHNOLOGY INC0 citations62
US11581317B2Feb 14, 2023

Integrated assemblies having shield lines between digit lines, and methods of forming integrated assemblies

MICRON TECHNOLOGY INC0 citations62
US11563010B2Jan 24, 2023

Integrated assemblies, and methods of forming integrated assemblies

MICRON TECHNOLOGY INC0 citations62
US11393928B2Jul 19, 2022

Access devices formed with conductive contacts

MICRON TECHNOLOGY INC0 citations62
US12507400B2Dec 23, 2025

Vertically stacked storage nodes and access devices with horizontal access lines

MICRON TECHNOLOGY INC0 citations52
US12457734B2Oct 28, 2025

Two transistor cells for vertical three-dimensional memory

MICRON TECHNOLOGY INC0 citations52
US11653488B2May 16, 2023

Apparatuses including transistors, and related methods, memory devices, and electronic systems

MICRON TECHNOLOGY INC0 citations52
US11469230B2Oct 11, 2022

Vertically separated storage nodes and access devices for semiconductor devices

MICRON TECHNOLOGY INC0 citations52
US10756217B2Aug 25, 2020

Access devices formed with conductive contacts

MICRON TECHNOLOGY INC0 citations52
US12356617B2Jul 8, 2025

Microelectronic devices with vertically recessed channel structures and discrete, spaced inter-slit structures, and related methods and systems

MICRON TECHNOLOGY INC0 citations51

TCL CHINA STAR OPTOELECTRONICS TECH CO LTD

3 patents

LODESTAR LICENSING GROUP LLC

1 patent

UNIV SHANGHAI JIAOTONG

1 patent

BOE TECHNOLOGY GROUP CO LTD

1 patent