Inventor
SHIN JIWON
KR16 patents
⚠️ This page may combine multiple inventors who share the name “SHIN JIWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
7 patentsUS10872875B2Dec 22, 2020
Bonding head and method for bonding semiconductor package, and semiconductor package
SAMSUNG ELECTRONICS CO LTD7 citations80
US11676904B2Jun 13, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations67
US12272652B2Apr 8, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations56
US11749592B2Sep 5, 2023
Package-on-package type semiconductor package including a lower semiconductor package and an upper semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations53
US12406917B2Sep 2, 2025
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations45
US12463122B2Nov 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations44
US12288745B2Apr 29, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations44
AMQ SOLUTIONS LLC
5 patentsUSD915797SApr 13, 2021
Mobile storage arrangement
AMQ SOLUTIONS LLC9 citations83
USD891809SAug 4, 2020
Chair
AMQ SOLUTIONS LLC11 citations82
USD1023627SApr 23, 2024
Workstation
AMQ SOLUTIONS LLC7 citations80
US10869550B2Dec 22, 2020
Mobile office storage assembly
AMQ SOLUTIONS LLC2 citations71
USD1023624SApr 23, 2024
Collapsible workstation
AMQ SOLUTIONS LLC0 citations57