Inventor

SHIN JOONSIK

KR2 patents

⚠️ This page may combine multiple inventors who share the name “SHIN JOONSIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

1 patent

US8030752B2Oct 4, 2011

Method of manufacturing semiconductor package and semiconductor plastic package using the same

SAMSUNG ELECTRO MECH2 citations59

IKEGUCHI NOBUYUKI

1 patent

US8174128B2May 8, 2012

Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method

IKEGUCHI NOBUYUKI5 citations57