P

Inventor

HUANG WEN HUNG

TW153 patents
⚠️ This page may combine multiple inventors who share the name “HUANG WEN HUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

16 patents
US10756054B1Aug 25, 2020

Semiconductor package and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG13 citations86
US10903169B2Jan 26, 2021

Conductive structure and wiring structure including the same

ADVANCED SEMICONDUCTOR ENG5 citations84
US11908815B2Feb 20, 2024

Semiconductor device package

ADVANCED SEMICONDUCTOR ENG2 citations73
US11488901B2Nov 1, 2022

Package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations73
US11322471B2May 3, 2022

Semiconductor package structures, semiconductor device packages and methods of manufacturing the same

ADVANCED SEMICONDUCTOR ENG5 citations73
US11309264B2Apr 19, 2022

Semiconductor device package

ADVANCED SEMICONDUCTOR ENG3 citations73
US10939561B1Mar 2, 2021

Wiring structure and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG3 citations73
US9984986B1May 29, 2018

Semiconductor device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG4 citations73
US11018120B2May 25, 2021

Semiconductor device package with stress buffering layer and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG4 citations70
US11127697B2Sep 21, 2021

Semiconductor device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations69
US10892213B2Jan 12, 2021

Wiring structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG3 citations66
US12557709B2Feb 17, 2026

Package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations63
US12315820B2May 27, 2025

Wiring structure including low- and high-density conductive structures

ADVANCED SEMICONDUCTOR ENG0 citations63
US12315797B2May 27, 2025

Semiconductor substrate structure and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations63
US12249585B2Mar 11, 2025

Semiconductor device package

ADVANCED SEMICONDUCTOR ENG0 citations63
US12021044B2Jun 25, 2024

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations63

TAIWAN SEMICONDUCTOR MFG CO LTD

11 patents

HANNSPREE INC

4 patents

DELL PRODUCTS LP

3 patents

HUANG WEN-HUNG

2 patents

LAING BAN INTERNAT INC

2 patents

RICHTEK TECHNOLOGY CORP

2 patents

NXP BV

2 patents

TAIWAN SEMICONDUCTOR MFG

1 patent

QUANTA COMP INC

1 patent

PENG YUNG-CHOW

1 patent

CHUEH YUNG FA

1 patent

LIOU GUAN-DE

1 patent

ALITEK TECH CORP

1 patent

HANSPREE INC

1 patent

DIJIYA ENERGY SAVING TECHNOLOGY INC

1 patent

Showing the top 50 of 153 patents by PatentIndex Score.