Inventor
LEE YEONJIN
KR20 patents
Patents
20 patentsUS11476220B2Oct 18, 2022
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD2 citations72
US11670559B2Jun 6, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations71
US11587897B2Feb 21, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations71
US11049827B2Jun 29, 2021
Semiconductor devices including a thick metal layer and a bump
SAMSUNG ELECTRONICS CO LTD3 citations71
US12554438B2Feb 17, 2026
Memory device and computing system including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12199015B2Jan 14, 2025
Semiconductor device including via structure and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12183660B2Dec 31, 2024
Semiconductor device including through-silicon via and method of forming the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US12080663B2Sep 3, 2024
Semiconductor devices including a thick metal layer and a bump
SAMSUNG ELECTRONICS CO LTD0 citations61
US11948882B2Apr 2, 2024
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11817408B2Nov 14, 2023
Semiconductor devices including a thick metal layer and a bump
SAMSUNG ELECTRONICS CO LTD0 citations61
US11756843B2Sep 12, 2023
Semiconductor devices including scribe lane and method of manufacturing the semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations61
US11557556B2Jan 17, 2023
Semiconductor devices including a thick metal layer and a bump
SAMSUNG ELECTRONICS CO LTD0 citations61
US11495533B2Nov 8, 2022
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11342235B2May 24, 2022
Semiconductor devices including scribe lane and method of manufacturing the semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations61
US12550683B2Feb 10, 2026
Semiconductor packages having test pads
SAMSUNG ELECTRONICS CO LTD0 citations56
US12288734B2Apr 29, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US12347747B2Jul 1, 2025
Semiconductor devices including a through-hole electrode
SAMSUNG ELECTRONICS CO LTD0 citations50
US12230587B2Feb 18, 2025
Semiconductor device with crack-preventing structure
SAMSUNG ELECTRONICS CO LTD0 citations50
US12072374B2Aug 27, 2024
Detection pad structure for analysis in a semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations50
US11776894B2Oct 3, 2023
Semiconductor chip including low-k dielectric layer
SAMSUNG ELECTRONICS CO LTD0 citations50