Inventor
WANG XINCHAO
CH6 patents
⚠️ This page may combine multiple inventors who share the name “WANG XINCHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
JIANGSU CHANGJIANG ELECTRONICS
5 patentsUS9209117B2Dec 8, 2015
No-exposed-pad quad flat no-lead (QFN) packaging structure and method for manufacturing the same
JIANGSU CHANGJIANG ELECTRONICS2 citations57
US9362214B2Jun 7, 2016
Pre-encapsulated etching-then-plating lead frame structure with island and method for manufacturing the same
JIANGSU CHANGJIANG ELECTRONICS0 citations36
US9252113B2Feb 2, 2016
No-exposed-pad ball grid array (BGA) packaging structures and method for manufacturing the same
JIANGSU CHANGJIANG ELECTRONICS0 citations36
US9209115B2Dec 8, 2015
Quad flat no-lead (QFN) packaging structure and method for manufacturing the same
JIANGSU CHANGJIANG ELECTRONICS0 citations36
US9105622B2Aug 11, 2015
Barrel-plating quad flat no-lead (QFN) packaging structures and method for manufacturing the same
JIANGSU CHANGJIANG ELECTRONICS0 citations36