Inventor
HUANG TZU-SUNG
TW38 patents
⚠️ This page may combine multiple inventors who share the name “HUANG TZU-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
37 patentsUS10269773B1Apr 23, 2019
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD45 citations98
US11244906B2Feb 8, 2022
Semiconductor structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10790244B2Sep 29, 2020
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11848288B2Dec 19, 2023
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11682655B2Jun 20, 2023
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11664325B2May 30, 2023
Semiconductor structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11502039B2Nov 15, 2022
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11133269B2Sep 28, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11075176B2Jul 27, 2021
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10971477B2Apr 6, 2021
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10950519B2Mar 16, 2021
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10784203B2Sep 22, 2020
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10530175B2Jan 7, 2020
Hexagonal semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11227837B2Jan 18, 2022
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US12261092B2Mar 25, 2025
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12288729B2Apr 29, 2025
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12255184B2Mar 18, 2025
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12159839B2Dec 3, 2024
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11996227B2May 28, 2024
Hexagonal semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11935804B2Mar 19, 2024
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11837517B2Dec 5, 2023
Packaged semiconductor devices with wireless charging means
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11626339B2Apr 11, 2023
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11532425B2Dec 20, 2022
Hexagonal semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11251644B2Feb 15, 2022
Packaged semiconductor devices with wireless charging means
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12374627B2Jul 29, 2025
Method of fabricating semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12040283B2Jul 16, 2024
Method of fabricating semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11942433B2Mar 26, 2024
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12388041B2Aug 12, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12362329B2Jul 15, 2025
Method of fabricating semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12266639B2Apr 1, 2025
Method of fabricating semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11935871B2Mar 19, 2024
Semiconductor package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12564089B2Feb 24, 2026
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12406941B2Sep 2, 2025
Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10651675B2May 12, 2020
Packaged semiconductor devices with wireless charging means
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10097030B2Oct 9, 2018
Packaged semiconductor devices with wireless charging means
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12438007B2Oct 7, 2025
Staggered metal mesh on backside of device die and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12362270B2Jul 15, 2025
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51