Inventor
HUANG CHIEN-MEI
TW8 patents
Patents
8 patentsUS11018120B2May 25, 2021
Semiconductor device package with stress buffering layer and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations70
US12513815B2Dec 30, 2025
Electronic device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations60
US12300677B2May 13, 2025
Semiconductor device package including stress buffering layer
ADVANCED SEMICONDUCTOR ENG0 citations60
US12218075B2Feb 4, 2025
Package structure
ADVANCED SEMICONDUCTOR ENG0 citations60
US11721678B2Aug 8, 2023
Semiconductor device package including stress buffering layer
ADVANCED SEMICONDUCTOR ENG0 citations60
US11031326B2Jun 8, 2021
Wiring structure, electronic device and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations60
US10643937B2May 5, 2020
Wiring structure, electronic device and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations60
US10522492B2Dec 31, 2019
Semiconductor package and semiconductor process
ADVANCED SEMICONDUCTOR ENG0 citations39