Inventor
KLOCKE JOHN L
US34 patents
⚠️ This page may combine multiple inventors who share the name “KLOCKE JOHN L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
21 patentsUS12116686B2Oct 15, 2024
Parameter adjustment model for semiconductor processing chambers
APPLIED MATERIALS INC2 citations71
US11634830B2Apr 25, 2023
Electrochemical depositions of nanotwin copper materials
APPLIED MATERIALS INC2 citations71
US10546762B2Jan 28, 2020
Drying high aspect ratio features
APPLIED MATERIALS INC6 citations71
US10002771B1Jun 19, 2018
Methods for chemical mechanical polishing (CMP) processing with ozone
APPLIED MATERIALS INC3 citations67
US12209325B2Jan 28, 2025
Nanofiltration for wafer rinsing
APPLIED MATERIALS INC0 citations62
US10227707B2Mar 12, 2019
Inert anode electroplating processor and replenisher
APPLIED MATERIALS INC1 citations62
US12404597B2Sep 2, 2025
Electrochemical depositions of nanotwin copper materials
APPLIED MATERIALS INC0 citations61
US11973034B2Apr 30, 2024
Nanotwin copper materials in semiconductor devices
APPLIED MATERIALS INC0 citations61
US10971354B2Apr 6, 2021
Drying high aspect ratio features
APPLIED MATERIALS INC0 citations61
US12188144B2Jan 7, 2025
Wafer immersion in semiconductor processing chambers
APPLIED MATERIALS INC0 citations59
US11982008B2May 14, 2024
Electroplating system
APPLIED MATERIALS INC0 citations58
US11578422B2Feb 14, 2023
Electroplating system
APPLIED MATERIALS INC0 citations58
US11268208B2Mar 8, 2022
Electroplating system
APPLIED MATERIALS INC0 citations58
US10240248B2Mar 26, 2019
Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control
APPLIED MATERIALS INC1 citations58
US11211252B2Dec 28, 2021
Systems and methods for copper (I) suppression in electrochemical deposition
APPLIED MATERIALS INC0 citations52
US11901225B2Feb 13, 2024
Diffusion layers in metal interconnects
APPLIED MATERIALS INC0 citations51
US12344955B2Jul 1, 2025
Electroplating co-planarity improvement by die shielding
APPLIED MATERIALS INC0 citations50
US10191379B2Jan 29, 2019
Removing photoresist from a wafer
APPLIED MATERIALS INC0 citations50
US10840104B2Nov 17, 2020
Controlled etch of nitride features
APPLIED MATERIALS INC0 citations49
US12146235B2Nov 19, 2024
Plating and deplating currents for material co-planarity in semiconductor plating processes
APPLIED MATERIALS INC0 citations45
US12469720B2Nov 11, 2025
Electroplating wetting chamber with reduced bubble entrapment
APPLIED MATERIALS INC0 citations44
SEMITOOL INC
8 patentsUS6911127B2Jun 28, 2005
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC17 citations92
US6527925B1Mar 4, 2003
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC23 citations92
US7585398B2Sep 8, 2009
Chambers, systems, and methods for electrochemically processing microfeature workpieces
SEMITOOL INC11 citations84
US7169280B2Jan 30, 2007
Apparatus and method for deposition of an electrophoretic emulsion
SEMITOOL INC7 citations74
US7048841B2May 23, 2006
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC5 citations73
US6939448B2Sep 6, 2005
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
SEMITOOL INC6 citations73
US7150816B2Dec 19, 2006
Apparatus and method for deposition of an electrophoretic emulsion
SEMITOOL INC1 citations63
US7794573B2Sep 14, 2010
Systems and methods for electrochemically processing microfeature workpieces
SEMITOOL INC3 citations62
BASKARAN RAJESH
3 patentsUS8961771B2Feb 24, 2015
Electrolytic process using cation permeable barrier
BASKARAN RAJESH2 citations60
US8236159B2Aug 7, 2012
Electrolytic process using cation permeable barrier
BASKARAN RAJESH3 citations60
US8123926B2Feb 28, 2012
Electrolytic copper process using anion permeable barrier
BASKARAN RAJESH1 citations50