Inventor
PATTANAIK SURYA
US44 patents
⚠️ This page may combine multiple inventors who share the name “PATTANAIK SURYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
29 patentsUS5699212ADec 16, 1997
Method of electrostatic discharge protection of magnetic heads in a magnetic storage system
IBM98 citations98
US5465186ANov 7, 1995
Shorted magnetoresistive head leads for electrical overstress and electrostatic discharge protection during manufacture of a magnetic storage system
IBM210 citations98
US6539609B2Apr 1, 2003
Method of forming a head gimbal assembly
IBM59 citations96
US6459549B1Oct 1, 2002
Hard disk drive with slider support structure and head gimbal assembly
IBM84 citations96
US6055132AApr 25, 2000
Integrated lead suspension flexure for attaching a micro-actuator with a transducer slider
IBM85 citations96
US6052258AApr 18, 2000
Transducer suspension system
IBM57 citations96
US6046882AApr 4, 2000
Solder balltape and method for making electrical connection between a head transducer and an electrical lead
IBM51 citations96
US5828031AOct 27, 1998
Head transducer to suspension lead termination by solder ball place/reflow
IBM81 citations96
US5821494AOct 13, 1998
Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow
IBM73 citations96
US5530604AJun 25, 1996
Electrical connection and slider-suspension assembly having an improved electrical connection
IBM77 citations96
US4761699AAug 2, 1988
Slider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file
IBM221 citations96
US6336581B1Jan 8, 2002
Solder ball connection device and capillary tube thereof
IBM71 citations94
US5949618ASep 7, 1999
Solder bump electrical connection and method for fabrication
IBM20 citations93
US5815347ASep 29, 1998
Information storage system having an improved planar head-suspension assembly
IBM24 citations93
US6543677B2Apr 8, 2003
Solder-ball bonding device and method
IBM51 citations92
US6351348B1Feb 26, 2002
Minimal stiffness conductors for a head gimbal assembly
IBM24 citations92
US6318624B1Nov 20, 2001
Solder balltape and method for making electrical connection between a head transducer and an electrical lead
IBM30 citations92
US6282064B1Aug 28, 2001
Head gimbal assembly with integrated electrical conductors
IBM41 citations92
US6212046B1Apr 3, 2001
Arm assembly for a disk drive device and a method for fabricating the same
IBM37 citations92
US5955176ASep 21, 1999
Integrated suspension using a high strength conductive material
IBM36 citations92
US5889636AMar 30, 1999
Electrical connection for slider/suspension assembly
IBM39 citations92
US5875071AFeb 23, 1999
Planar HGA for Pico/Nano slider
IBM34 citations92
US5872687AFeb 16, 1999
Transducer suspension system
IBM34 citations92
US5781379AJul 14, 1998
Single beam flexure for a head gimbal assembly
IBM49 citations92
US5739982AApr 14, 1998
Laser treatment of head gimbal assembly components
IBM48 citations92
US5680275AOct 21, 1997
Adjustable solder bump spacer for slider-suspension attachment
IBM37 citations92
US5668684ASep 16, 1997
Electrical interconnect for a head/arm assembly of computer disk drives
IBM54 citations92
US6523250B2Feb 25, 2003
Method of attaching a slider with head transducer to a suspension
IBM24 citations89
US6442828B1Sep 3, 2002
Method of manufacturing a transducer suspension system
IBM13 citations74
HITACHI GLOBAL STORAGE TECH
11 patentsUS6833978B2Dec 21, 2004
Micro-actuator integrated lead suspension head terminations
HITACHI GLOBAL STORAGE TECH47 citations96
US6927946B2Aug 9, 2005
Micro-actuator integrated lead suspension head terminations
HITACHI GLOBAL STORAGE TECH19 citations92
US6785094B2Aug 31, 2004
Weld free high performance laminate suspension
HITACHI GLOBAL STORAGE TECH34 citations92
US7137187B2Nov 21, 2006
Integrated lead suspension for high density drive
HITACHI GLOBAL STORAGE TECH18 citations91
US6993824B2Feb 7, 2006
Method of controlling pitch static attitude of sliders on integrated lead suspensions by improved plastic deformation processing
HITACHI GLOBAL STORAGE TECH28 citations91
US6992862B2Jan 31, 2006
Disk drive with controlled pitch static attitude of sliders on integrated lead suspensions by improved plastic deformation processing
HITACHI GLOBAL STORAGE TECH27 citations91
US6965501B1Nov 15, 2005
Integrated lead suspension for high density drive
HITACHI GLOBAL STORAGE TECH28 citations91
US6742694B2Jun 1, 2004
Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus
HITACHI GLOBAL STORAGE TECH32 citations89
US7152303B2Dec 26, 2006
Method of localized thermal processing of integrated lead suspensions for controlling the pitch static attitude of sliders
HITACHI GLOBAL STORAGE TECH17 citations83
US6676778B1Jan 13, 2004
Method for bonding slider and suspension together and deciding conditions of laser beam irradiation
HITACHI GLOBAL STORAGE TECH12 citations70
US6952329B2Oct 4, 2005
Disk drive with localized thermal processing of integrated lead suspensions for controlling the pitch static attitude of sliders
HITACHI GLOBAL STORAGE TECH3 citations61