Inventor
KIM JOONSUNG
KR21 patents
⚠️ This page may combine multiple inventors who share the name “KIM JOONSUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
20 patentsUS11735532B2Aug 22, 2023
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD3 citations70
US11355445B2Jun 7, 2022
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD2 citations70
US11127646B2Sep 21, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations69
US12283577B2Apr 22, 2025
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11791230B2Oct 17, 2023
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11689262B2Jun 27, 2023
Communication device for performing beamforming and operating method thereof
SAMSUNG ELECTRONICS CO LTD0 citations59
US11569957B2Jan 31, 2023
Method and apparatus for transmitting and receiving downlink control channel in shortened transmission time intervals
SAMSUNG ELECTRONICS CO LTD0 citations59
US12284066B2Apr 22, 2025
Apparatus and method for effectively mapping reference signal for V2X communication in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations58
US12176262B2Dec 24, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations58
US11968648B2Apr 23, 2024
Apparatus and method for efficiently transceiving PSFCH for V2X communication in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations58
US11798862B2Oct 24, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations58
US11503569B2Nov 15, 2022
Apparatus and method for efficiently transceiving PSFCH for V2X communication in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations58
US12159833B2Dec 3, 2024
Fan-out semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations53
US11574868B2Feb 7, 2023
Fan-out semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations53
US11854912B2Dec 26, 2023
Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip pad
SAMSUNG ELECTRONICS CO LTD0 citations51
US11158581B2Oct 26, 2021
Semiconductor package having semiconductor chip between first and second redistribution layers
SAMSUNG ELECTRONICS CO LTD0 citations51
US12550324B2Feb 10, 2026
Three-dimensional semiconductor memory device and electronic system including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12439603B2Oct 7, 2025
Semiconductor device including separate upper channel structures and electronic system including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12438133B2Oct 7, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12062617B2Aug 13, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50