P

Inventor

KIM YOUNGBAE

KR33 patents
⚠️ This page may combine multiple inventors who share the name “KIM YOUNGBAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

19 patents
US9530741B2Dec 27, 2016

Semiconductor packages having residual stress layers and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD8 citations84
US10395706B2Aug 27, 2019

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD5 citations83
US9741668B2Aug 22, 2017

Semiconductor packages having residual stress layers and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD5 citations73
US10410722B2Sep 10, 2019

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD2 citations72
US9552879B2Jan 24, 2017

Nonvolatile memory device having variable resistance memory cells and a method of resetting by initially performing pre-read or strong set operation

SAMSUNG ELECTRONICS CO LTD4 citations70
US10971548B2Apr 6, 2021

Variable resistance memory device including symmetrical memory cell arrangements and method of forming the same

SAMSUNG ELECTRONICS CO LTD2 citations68
US11527470B2Dec 13, 2022

Film package and method of fabricating package module

SAMSUNG ELECTRONICS CO LTD1 citations61
US11140772B2Oct 5, 2021

Printed circuit board including warpage offset regions and semiconductor packages including the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US10699056B1Jun 30, 2020

Computer-implemented method, processor-implemented system, and non-transitory computer-readable storage medium storing instructions for simulation of printed circuit board

SAMSUNG ELECTRONICS CO LTD1 citations61
US12598961B2Apr 7, 2026

Semiconductor package including test pattern and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US12543580B2Feb 3, 2026

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations52
US12119288B2Oct 15, 2024

Semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations52
US10720211B2Jul 21, 2020

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations51
US10580469B2Mar 3, 2020

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations51
US11776866B2Oct 3, 2023

Semiconductor module heatspreading lid having integrated separators for multiple chips

SAMSUNG ELECTRONICS CO LTD0 citations50
US10506706B2Dec 10, 2019

Printed circuit board including warpage offset regions and semiconductor packages including the same

SAMSUNG ELECTRONICS CO LTD0 citations50
US10985213B2Apr 20, 2021

Nonvolatile memory device

SAMSUNG ELECTRONICS CO LTD0 citations49
US11367714B2Jun 21, 2022

Semiconductor package device

SAMSUNG ELECTRONICS CO LTD0 citations48
US10446560B2Oct 15, 2019

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations41

KIM YOUNGBAE

3 patents

SAMSUNG DISPLAY CO LTD

2 patents

HWANG MINKYU

2 patents

LG ELECTRONICS INC

1 patent

IM YUNHYEOK

1 patent

YOON ILSEOB

1 patent

HYUNDAI MOTOR CO LTD

1 patent

MAGNACHIP SEMICONDUCTOR LTD

1 patent

KANG YOUNSEON

1 patent

SK KEYFOUNDRY INC

1 patent