Inventor
KIM YOUNGBAE
KR33 patents
⚠️ This page may combine multiple inventors who share the name “KIM YOUNGBAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
19 patentsUS9530741B2Dec 27, 2016
Semiconductor packages having residual stress layers and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US10395706B2Aug 27, 2019
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD5 citations83
US9741668B2Aug 22, 2017
Semiconductor packages having residual stress layers and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD5 citations73
US10410722B2Sep 10, 2019
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD2 citations72
US9552879B2Jan 24, 2017
Nonvolatile memory device having variable resistance memory cells and a method of resetting by initially performing pre-read or strong set operation
SAMSUNG ELECTRONICS CO LTD4 citations70
US10971548B2Apr 6, 2021
Variable resistance memory device including symmetrical memory cell arrangements and method of forming the same
SAMSUNG ELECTRONICS CO LTD2 citations68
US11527470B2Dec 13, 2022
Film package and method of fabricating package module
SAMSUNG ELECTRONICS CO LTD1 citations61
US11140772B2Oct 5, 2021
Printed circuit board including warpage offset regions and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US10699056B1Jun 30, 2020
Computer-implemented method, processor-implemented system, and non-transitory computer-readable storage medium storing instructions for simulation of printed circuit board
SAMSUNG ELECTRONICS CO LTD1 citations61
US12598961B2Apr 7, 2026
Semiconductor package including test pattern and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US12543580B2Feb 3, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US12119288B2Oct 15, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations52
US10720211B2Jul 21, 2020
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations51
US10580469B2Mar 3, 2020
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations51
US11776866B2Oct 3, 2023
Semiconductor module heatspreading lid having integrated separators for multiple chips
SAMSUNG ELECTRONICS CO LTD0 citations50
US10506706B2Dec 10, 2019
Printed circuit board including warpage offset regions and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US10985213B2Apr 20, 2021
Nonvolatile memory device
SAMSUNG ELECTRONICS CO LTD0 citations49
US11367714B2Jun 21, 2022
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD0 citations48
US10446560B2Oct 15, 2019
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations41
KIM YOUNGBAE
3 patentsUS8871323B2Oct 28, 2014
Vacuum insulation member, refrigerator having vacuum insulation member, and method for fabricating vacuum insulation member
KIM YOUNGBAE43 citations91
US8852708B2Oct 7, 2014
Vacuum insulation member, refrigerator having vacuum insulation member, and method for fabricating vacuum insulation member
KIM YOUNGBAE52 citations90
US10043789B2Aug 7, 2018
Semiconductor packages including an adhesive pattern
KIM YOUNGBAE2 citations72
SAMSUNG DISPLAY CO LTD
2 patentsHWANG MINKYU
2 patentsUS8778477B2Jul 15, 2014
Vacuum insulation member, refrigerator having vacuum insulation member, and method for fabricating vacuum insulation member
HWANG MINKYU3 citations57
US8951622B2Feb 10, 2015
Vacuum insulation member, registrator having vacuum insulation member, and method for fabricating vacuum insulation member
HWANG MINKYU0 citations46