Inventor

BUCHWALTER STEPHEN L

US54 patents

⚠️ This page may combine multiple inventors who share the name “BUCHWALTER STEPHEN L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BUCHWALTER STEPHEN L

IBM

Cleavable diepoxide for removable epoxy compositions

Cleavable diepoxide for removable epoxy compositions

Patterned deposition of metals via photochemical decomposition of metal-oxalate complexes

Semiconductor structure with solder bumps

Injection molded microoptics

Display fabrication using modular active devices

Display fabrication using modular active devices

Bilayer wafer-level underfill

Precision alignment of plates

Reactive surface functionalization

Isoimide modifications of a polyimide and reaction thereof with nucleophiles

Surface midification of a polyimide

Process for producing a metal organic polymer combination

Method for conditioning an organic polymeric material

Method for etching an organic polymeric material

Sprocket opening alignment process and apparatus for multilayer solder decal

Solder interconnect structure and method using injection molded solder

Method of producing coaxial solder bump connections using injection molding of solder

Manufacture of printed circuit boards with stubless plated through-holes

Reworkable electronic device assembly and method

Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation

Method and solution for cleaning solder connections of electronic components

Charge transfer salts and uses thereof

Method for conditioning an organic polymeric material

Polyimides reaction products and use in electrophoretic deposition

Process for making stubless printed circuit boards

Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays

Method for bonding two surfaces together

Ultrasonic-assisted solder transfer

Micro-fluidic injection molded solder (IMS)

Precision alignment of plates

Covalent compound having a radical-cationic moiety covalently linked to a radical anionicmoiety

Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation

Combination polyimide decal with a rigid mold

PPG INDUSTRIES INC

Michael adducts of polymeric materials useful in coating applications

Cationic electrodeposition using aqueous dispersions of quaternary ammonium carbonate-containing polymers

Resinous coating compositions curable by Michael adduct exchange

Novel acrylic polymers and the Michael adducts thereof useful in coating applications

Process for electrodeposition of Michael adducts of polymeric materials

Curable resinous compositions useful in coating applications

Acrylic polymers and the Michael adducts thereof useful in coating applications

Cationic electrodeposition using aqueous dispersions of quaternary ammonium carbonate-containing polymers

Self-curable resinous compositions useful in coating applications

Self-curable resinous compositions containing N-methylol amide groups useful in coating applications

BUCHWALTER STEPHEN L

Micro-fluidic injection molded solder (IMS)

Process for making stubless printed circuit boards

INTERNAT BUSINSS MACHINES CORP

Micro-fluidic injection molded solder (IMS)

ANDRY PAUL S

Reworkable electronic device assembly and method

BELANGER LUC

Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers

INTELLECTUAL BUSINESS MACHINES

Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays