Inventor
OHASHI NAOFUMI
JP102 patents
⚠️ This page may combine multiple inventors who share the name “OHASHI NAOFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
15 patentsUS10424520B1Sep 24, 2019
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP15 citations85
US11728183B2Aug 15, 2023
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP2 citations73
US11538661B1Dec 27, 2022
Substrate processing apparatus
KOKUSAI ELECTRIC CORP3 citations73
US11322370B1May 3, 2022
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP3 citations73
US11145505B1Oct 12, 2021
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP5 citations73
US11473196B2Oct 18, 2022
Substrate processing apparatus
KOKUSAI ELECTRIC CORP4 citations72
US10685832B1Jun 16, 2020
Substrate processing apparatus
KOKUSAI ELECTRIC CORP3 citations72
US10651068B1May 12, 2020
Method of manufacturing semiconductor device by setting process chamber to maintenance enable state
KOKUSAI ELECTRIC CORP1 citations72
US10453720B1Oct 22, 2019
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP3 citations72
US12581882B2Mar 17, 2026
Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations63
US11600488B2Mar 7, 2023
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP1 citations63
US11043377B1Jun 22, 2021
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP1 citations63
US11037823B2Jun 15, 2021
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations63
US11027970B2Jun 8, 2021
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations63
US12424409B2Sep 23, 2025
Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations62
RENESAS TECH CORP
12 patentsUS6908847B2Jun 21, 2005
Method of manufacturing a semiconductor device having an interconnect embedded in an insulating film
RENESAS TECH CORP46 citations96
US7659201B2Feb 9, 2010
Process for manufacturing semiconductor integrated circuit device
RENESAS TECH CORP10 citations93
US6730590B2May 4, 2004
Semiconductor integrated circuit device and fabrication process thereof
RENESAS TECH CORP23 citations93
US6716749B2Apr 6, 2004
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP14 citations93
US6864169B2Mar 8, 2005
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP12 citations92
US7510970B2Mar 31, 2009
Process for manufacturing semiconductor integrated circuit device
RENESAS TECH CORP5 citations74
US6849535B2Feb 1, 2005
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP9 citations74
US6800557B2Oct 5, 2004
Process for manufacturing semiconductor integrated circuit device
RENESAS TECH CORP8 citations74
US6815330B2Nov 9, 2004
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP3 citations73
US6797606B2Sep 28, 2004
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP3 citations73
US6797609B2Sep 28, 2004
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
RENESAS TECH CORP9 citations73
US6855035B2Feb 15, 2005
Apparatus and method for producing substrate with electrical wire thereon
RENESAS TECH CORP5 citations63
HITACHI LTD
10 patentsUS6184143B1Feb 6, 2001
Semiconductor integrated circuit device and fabrication process thereof
HITACHI LTD342 citations99
US6326299B1Dec 4, 2001
Method for manufacturing a semiconductor device
HITACHI LTD88 citations98
US6376345B1Apr 23, 2002
Process for manufacturing semiconductor integrated circuit device
HITACHI LTD46 citations96
US6638854B2Oct 28, 2003
Semiconductor device and method for manufacturing the same
HITACHI LTD25 citations93
US6561875B1May 13, 2003
Apparatus and method for producing substrate with electrical wire thereon
HITACHI LTD20 citations93
US6509273B1Jan 21, 2003
Method for manufacturing a semiconductor device
HITACHI LTD36 citations93
US6458674B1Oct 1, 2002
Process for manufacturing semiconductor integrated circuit device
HITACHI LTD16 citations93
US6403459B1Jun 11, 2002
Fabrication process of semiconductor integrated circuit device
HITACHI LTD22 citations93
US6531400B2Mar 11, 2003
Process for manufacturing semiconductor integrated circuit device
HITACHI LTD12 citations82
US6756679B2Jun 29, 2004
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
HITACHI LTD8 citations73
HITACHI INT ELECTRIC INC
10 patentsUS9431220B1Aug 30, 2016
Substrate processing apparatus and substrate processing system
HITACHI INT ELECTRIC INC10 citations84
US9018689B1Apr 28, 2015
Substrate processing apparatus and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC10 citations84
US10934622B2Mar 2, 2021
Substrate processing apparatus
HITACHI INT ELECTRIC INC5 citations73
US9966261B1May 8, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC2 citations73
US9728431B2Aug 8, 2017
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC2 citations73
US9698050B1Jul 4, 2017
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC3 citations73
US9484249B1Nov 1, 2016
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC4 citations73
US9786493B2Oct 10, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC2 citations71
US10883172B2Jan 5, 2021
Method of manufacturing lithography template
HITACHI INT ELECTRIC INC0 citations63
US7955948B2Jun 7, 2011
Manufacturing method of semiconductor device
HITACHI INT ELECTRIC INC2 citations63
SONY CORP
1 patentRENESASTECHNOLOGY CORP
1 patentSANYO ELECTRIC CO
1 patentShowing the top 50 of 102 patents by PatentIndex Score.