Inventor
HYUN SONGWON
KR3 patents
Patents
3 patentsUS12528906B2Jan 20, 2026
Epoxy compound, composition prepared therefrom, semiconductor device prepared therefrom, electronic device prepared therefrom, article prepared therefrom, and method of preparing epoxy compound
SAMSUNG ELECTRONICS CO LTD0 citations54
US11827741B2Nov 28, 2023
Epoxy compound, composition prepared therefrom, semiconductor device prepared therefrom, electronic device prepared therefrom, article prepared therefrom, and method of preparing epoxy compound
SAMSUNG ELECTRONICS CO LTD0 citations54
US11926695B2Mar 12, 2024
High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations48