Inventor
BOLAND BERNARD W
US17 patents
⚠️ This page may combine multiple inventors who share the name “BOLAND BERNARD W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
13 patentsUS4649630AMar 17, 1987
Process for dielectrically isolated semiconductor structure
MOTOROLA INC36 citations92
US5114875AMay 19, 1992
Planar dielectric isolated wafer
MOTOROLA INC20 citations80
US5084407AJan 28, 1992
Method for planarizing isolated regions
MOTOROLA INC20 citations78
US5254491AOct 19, 1993
Method of making a semiconductor device having improved frequency response
MOTOROLA INC16 citations74
US5145795ASep 8, 1992
Semiconductor device and method therefore
MOTOROLA INC13 citations73
US5001075AMar 19, 1991
Fabrication of dielectrically isolated semiconductor device
MOTOROLA INC9 citations73
US4609413ASep 2, 1986
Method for manufacturing and epitaxially isolated semiconductor utilizing etch and refill technique
MOTOROLA INC9 citations73
US5237183AAug 17, 1993
High reverse voltage IGT
MOTOROLA INC10 citations72
US4870467ASep 26, 1989
Monolithic temperature compensated voltage-reference diode and method of its manufacture
MOTOROLA INC17 citations71
US4636269AJan 13, 1987
Epitaxially isolated semiconductor device process utilizing etch and refill technique
MOTOROLA INC6 citations62
US4010290AMar 1, 1977
Method of fabricating an ensulated gate field-effect device
MOTOROLA INC4 citations62
US4886762ADec 12, 1989
Monolithic temperature compensated voltage-reference diode and method for its manufacture
MOTOROLA INC5 citations60
US5077594ADec 31, 1991
Integrated high voltage transistors having minimum transistor to transistor crosstalk
MOTOROLA INC1 citations52