Inventor
HERMANN KARL
US19 patents
⚠️ This page may combine multiple inventors who share the name “HERMANN KARL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS5006924AApr 9, 1991
Heat sink for utilization with high density integrated circuit substrates
IBM136 citations98
US5313097AMay 17, 1994
High density memory module
IBM184 citations96
US5121299AJun 9, 1992
Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein
IBM80 citations96
US5065227ANov 12, 1991
Integrated circuit packaging using flexible substrate
IBM111 citations96
US5053853AOct 1, 1991
Modular electronic packaging system
IBM58 citations96
US5161087ANov 3, 1992
Pivotal heat sink assembly
IBM79 citations95
US5037311AAug 6, 1991
High density interconnect strip
IBM61 citations95
US5363275ANov 8, 1994
Modular component computer system
IBM33 citations92
US5290710AMar 1, 1994
Method for testing integrated circuits on a carrier substrate
IBM32 citations92
US5146674ASep 15, 1992
Manufacturing process of a high density substrate design
IBM40 citations92
US4975637ADec 4, 1990
Method and apparatus for integrated circuit device testing
IBM48 citations92
US5786986AJul 28, 1998
Multi-level circuit card structure
IBM61 citations91
US5222668AJun 29, 1993
Fluid actuated connector
IBM19 citations82
US5148003ASep 15, 1992
Modular test oven
IBM15 citations82
US5205740AApr 27, 1993
Super connector for connecting flat ribbon cables
IBM14 citations74
US4495479AJan 22, 1985
Selective wiring for multilayer printed circuit board
IBM7 citations74
US5140879AAug 25, 1992
Variable array punch
IBM13 citations73
US4946708AAug 7, 1990
Pin transfer adhesive application for surface mount component processes
IBM8 citations73