Inventor
TSUKAMOTO HIDEO
US29 patents
⚠️ This page may combine multiple inventors who share the name “TSUKAMOTO HIDEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
8 patentsUS7196883B2Mar 27, 2007
Superconducting magnet system with quench protection circuit
HITACHI LTD10 citations84
US7161777B2Jan 9, 2007
Superconducting magnet system with quench protection circuit
HITACHI LTD8 citations73
US7336077B2Feb 26, 2008
Magnet for NMR analyzer and NMR analyzer using the same
HITACHI LTD5 citations72
US7187175B2Mar 6, 2007
Magnet for NMR analyzer and NMR analyzer using the same
HITACHI LTD8 citations72
US7141977B2Nov 28, 2006
Magnet for NMR analyzer and NMR analyzer using the same
HITACHI LTD10 citations72
US7750636B2Jul 6, 2010
NMR system
HITACHI LTD4 citations60
US7570057B2Aug 4, 2009
NMR spectrometer
HITACHI LTD4 citations60
US7049913B2May 23, 2006
Superconductivity magnet apparatus
HITACHI LTD3 citations59
MITSUBISHI HEAVY IND LTD
5 patentsUS4802253AFeb 7, 1989
Dry cleaning method using at least two kinds of solvents
MITSUBISHI HEAVY IND LTD42 citations92
US4712392ADec 15, 1987
Dry cleaning apparatus
MITSUBISHI HEAVY IND LTD26 citations92
US5107605AApr 28, 1992
Method and apparatus for dry cleaning as well as method and device for recovery of solvent therein
MITSUBISHI HEAVY IND LTD23 citations91
US4897859AJan 30, 1990
Apparatus for identifying and counting linens in bags or bundles
MITSUBISHI HEAVY IND LTD12 citations74
US5195252AMar 23, 1993
Method for dry cleaning as well as a method for recovery of solvent therein
MITSUBISHI HEAVY IND LTD11 citations72
HIROTSURU HIDEKI
5 patentsUS8890189B2Nov 18, 2014
Wafer for LED mounting, method for manufacturing same, and LED-mounted structure using the wafer
HIROTSURU HIDEKI2 citations61
US8322398B2Dec 4, 2012
Manufacturing method of aluminum-diamond composite
HIROTSURU HIDEKI4 citations61
US9524918B2Dec 20, 2016
Heat dissipating component for semiconductor element
HIROTSURU HIDEKI0 citations51
US9387532B2Jul 12, 2016
Composite substrate for LED light emitting element, method of production of same, and LED light emitting element
HIROTSURU HIDEKI0 citations51
US9017824B2Apr 28, 2015
Aluminum-diamond composite and manufacturing method
HIROTSURU HIDEKI1 citations51
YOKOGAWA ELECTRIC CORP
3 patentsUS5959213ASep 28, 1999
Semiconductor differential pressure measuring device
YOKOGAWA ELECTRIC CORP36 citations92
US5123282AJun 23, 1992
Vibrating type pressure measuring device
YOKOGAWA ELECTRIC CORP23 citations89
US5375473ADec 27, 1994
Semiconductor type differential pressure measurement apparatus and method for manufacturing the same
YOKOGAWA ELECTRIC CORP14 citations73
DENKA COMPANY LTD
3 patentsUS10541189B2Jan 21, 2020
Heat dissipation component for semiconductor element
DENKA COMPANY LTD1 citations62
US10302375B2May 28, 2019
Aluminum-diamond composite, and heat dissipating component using same
DENKA COMPANY LTD1 citations61
US10640853B2May 5, 2020
Aluminum-diamond-based composite and heat dissipation component
DENKA COMPANY LTD1 citations59