Inventor
Li zhao-bing
SG3 patents
Patents
3 patentsUS10784185B2Sep 22, 2020
Method for manufacturing semiconductor device with through silicon via structure
UNITED MICROELECTRONICS CORP4 citations68
US10546801B2Jan 28, 2020
Semiconductor device with through silicon via structure and method for manufacturing the same
UNITED MICROELECTRONICS CORP1 citations68
US11081427B2Aug 3, 2021
Semiconductor device with through silicon via structure
UNITED MICROELECTRONICS CORP0 citations58