Inventor
MIYAMOTO HIDENOBU
JP14 patents
⚠️ This page may combine multiple inventors who share the name “MIYAMOTO HIDENOBU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
10 patentsUS5690781ANov 25, 1997
Plasma processing apparatus for manufacture of semiconductor devices
NEC CORP105 citations97
US5937300AAug 10, 1999
Semiconductor apparatus and fabrication method thereof
NEC CORP40 citations92
US5846331ADec 8, 1998
Plasma processing apparatus
NEC CORP32 citations92
US5645683AJul 8, 1997
Etching method for etching a semiconductor substrate having a silicide layer and a polysilicon layer
NEC CORP19 citations92
US5810932ASep 22, 1998
Plasma generating apparatus used for fabrication of semiconductor device
NEC CORP18 citations91
US6319844B1Nov 20, 2001
Method of manufacturing semiconductor device with via holes reaching interconnect layers having different top-surface widths
NEC CORP9 citations73
US5407862AApr 18, 1995
Method for manufacturing fine-structured stacked connection layer
NEC CORP17 citations73
US5340769AAug 23, 1994
Method for manufacturing semiconductor device having groove-structured isolation
NEC CORP13 citations73
US5246888ASep 21, 1993
Method of preventing corrosion of aluminum alloys
NEC CORP9 citations73
US5792710AAug 11, 1998
Method for selectively etching polycide layer
NEC CORP10 citations68
NEC ELECTRONICS CORP
4 patentsUS7615498B2Nov 10, 2009
Method of manufacturing a semiconductor device
NEC ELECTRONICS CORP10 citations84
US7180191B2Feb 20, 2007
Semiconductor device and method of manufacturing a semiconductor device
NEC ELECTRONICS CORP14 citations84
US6927495B2Aug 9, 2005
Semiconductor device and method of manufacturing same
NEC ELECTRONICS CORP9 citations73
US7341937B2Mar 11, 2008
Semiconductor device and method of manufacturing same
NEC ELECTRONICS CORP2 citations62