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Inventor
REEDER WILLAM J
US
2 patents
⚠️ This page may combine multiple inventors who share the name “REEDER WILLAM J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
1 patent
US6914326B2
Jul 5, 2005
Solder ball landpad design to improve laminate performance
MICRON TECHNOLOGY INC
11 citations
71
ROUND ROCK RES LLC
1 patent
US7951646B2
May 31, 2011
Solder ball landpad design to improve laminate performance
ROUND ROCK RES LLC
0 citations
50