Inventor
SCHONAUER DIANA M
US17 patents
Patents
17 patentsUS5662769ASep 2, 1997
Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning
ADVANCED MICRO DEVICES INC107 citations98
US6218290B1Apr 17, 2001
Copper dendrite prevention by chemical removal of dielectric
ADVANCED MICRO DEVICES INC56 citations96
US6074949AJun 13, 2000
Method of preventing copper dendrite formation and growth
ADVANCED MICRO DEVICES INC72 citations96
US6596637B1Jul 22, 2003
Chemically preventing Cu dendrite formation and growth by immersion
ADVANCED MICRO DEVICES INC22 citations92
US6503418B2Jan 7, 2003
Ta barrier slurry containing an organic additive
ADVANCED MICRO DEVICES INC52 citations92
US6433402B1Aug 13, 2002
Selective copper alloy deposition
ADVANCED MICRO DEVICES INC47 citations92
US6319833B1Nov 20, 2001
Chemically preventing copper dendrite formation and growth by spraying
ADVANCED MICRO DEVICES INC21 citations92
US6207569B1Mar 27, 2001
Prevention of Cu dendrite formation and growth
ADVANCED MICRO DEVICES INC18 citations92
US6169034B1Jan 2, 2001
Chemically removable Cu CMP slurry abrasive
ADVANCED MICRO DEVICES INC23 citations92
US6140239AOct 31, 2000
Chemically removable Cu CMP slurry abrasive
ADVANCED MICRO DEVICES INC44 citations92
US6720264B2Apr 13, 2004
Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties
ADVANCED MICRO DEVICES INC45 citations89
US5702563ADec 30, 1997
Reduced chemical-mechanical polishing particulate contamination
ADVANCED MICRO DEVICES INC37 citations89
US6197690B1Mar 6, 2001
Chemically preventing Cu dendrite formation and growth by double sided scrubbing
ADVANCED MICRO DEVICES INC16 citations84
US6177349B1Jan 23, 2001
Preventing Cu dendrite formation and growth
ADVANCED MICRO DEVICES INC17 citations84
US6162727ADec 19, 2000
Chemical treatment for preventing copper dendrite formation and growth
ADVANCED MICRO DEVICES INC14 citations74
US5936307AAug 10, 1999
Surface modification method for film stress reduction
ADVANCED MICRO DEVICES INC8 citations74
US6153933ANov 28, 2000
Elimination of residual materials in a multiple-layer interconnect structure
ADVANCED MICRO DEVICES INC13 citations71