Inventor
SHANAMAN III RICHARD HANDLY
US3 patents
Patents
3 patentsUS7214568B2May 8, 2007
Semiconductor device configured for reducing post-fabrication damage
AGERE SYSTEMS INC14 citations78
US7745927B2Jun 29, 2010
Heat sink formed of multiple metal layers on backside of integrated circuit die
AGERE SYSTEMS INC5 citations59
US7075174B2Jul 11, 2006
Semiconductor packaging techniques for use with non-ceramic packages
AGERE SYSTEMS INC4 citations58