Inventor

WANG JO-FEI

TW30 patents

⚠️ This page may combine multiple inventors who share the name “WANG JO-FEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG JO-FEI

TAIWAN SEMICONDUCTOR MFG

Method for bin-based control

Semiconductor processing dispatch control

Method and apparatus for automatic purge of HMDS vapor piping

Method and apparatus for automatic purge of HMDS vapor piping

Method for cleaning a photoresist developer spray stream nozzle

E-chuck for automated clamped force adjustment and calibration

Adaptive and automatic determination of system parameters

Method and system of monitoring E-beam overlay and providing advanced process control

TAIWAN SEMICONDUCTOR MFG CO LTD

Multi-zone temperature control for semiconductor wafer

Systems and associated methods for tuning processing tools

System and method for controlling ion implanter

Multi-zone temperature control for semiconductor wafer

Real-time calibration for wafer processing chamber lamp modules

TSAI PO-FENG

Adaptive and automatic determination of system parameters

Method and system for implementing virtual metrology in semiconductor fabrication

Integrated circuit manufacturing tool condition monitoring system and method

Processing exception handling

APC model extension using existing APC models

WU SUNNY

Semiconductor processing dispatch control

Physical failure analysis guiding methods

Semiconductor processing dispatch control

Device performance parmeter tuning method and system

HSU CHIH-WEI

Advanced process control for new tapeout product

Systems and methods of automatic boundary control for semiconductor processes

CHANG CHUN-LIN

Multi-zone temperature control for semiconductor wafer

TSEN ANDY

System and method for implementing a wafer acceptance test (“WAT”) advanced process control (“APC”) with novel sampling policy and architecture

HO CHIA-TONG

Qualitative fault detection and classification system for tool condition monitoring and associated methods

CHANG CHIH-TIEN

Real-time calibration for wafer processing chamber lamp modules

WANG JO FEI

E-chuck with automated clamped force adjustment and calibration

TSAI PO FENG

Method and system for tool condition monitoring based on a simulated inline measurement