Inventor
YEH HSIAO-LAN
TW7 patents
⚠️ This page may combine multiple inventors who share the name “YEH HSIAO-LAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XINTEC INC
4 patentsUS9947716B2Apr 17, 2018
Chip package and manufacturing method thereof
XINTEC INC2 citations71
US9875912B2Jan 23, 2018
Chip package and manufacturing method thereof
XINTEC INC0 citations49
US12463102B2Nov 4, 2025
Semiconductor device structure and method for forming the same
XINTEC INC0 citations48
US10388541B2Aug 20, 2019
Wafer coating system and method of manufacturing chip package
XINTEC INC0 citations47
TAIWAN SEMICONDUCTOR MFG
3 patentsUS6019849AFeb 1, 2000
Method and apparatus for automatic purge of HMDS vapor piping
TAIWAN SEMICONDUCTOR MFG11 citations69
US5763006AJun 9, 1998
Method and apparatus for automatic purge of HMDS vapor piping
TAIWAN SEMICONDUCTOR MFG5 citations58
US5908041AJun 1, 1999
Method for cleaning a photoresist developer spray stream nozzle
TAIWAN SEMICONDUCTOR MFG4 citations56