Inventor
WANG YING W
SG3 patents
Patents
3 patentsUS11854886B2Dec 26, 2023
Methods of TSV formation for advanced packaging
APPLIED MATERIALS INC2 citations70
US11404318B2Aug 2, 2022
Methods of forming through-silicon vias in substrates for advanced packaging
APPLIED MATERIALS INC2 citations70
US12374586B2Jul 29, 2025
Methods of TSV formation for advanced packaging
APPLIED MATERIALS INC0 citations59