P

Inventor

SHINOHARA TOSHIAKI

JP50 patents
⚠️ This page may combine multiple inventors who share the name “SHINOHARA TOSHIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

29 patents
US6421244B1Jul 16, 2002

Power module

MITSUBISHI ELECTRIC CORP117 citations98
US6313520B1Nov 6, 2001

Resin-sealed power semiconductor device including substrate with all electronic components for control circuit mounted thereon

MITSUBISHI ELECTRIC CORP83 citations98
US6979909B2Dec 27, 2005

Semiconductor device and method of manufacturing same

MITSUBISHI ELECTRIC CORP55 citations96
US6914321B2Jul 5, 2005

Semiconductor device

MITSUBISHI ELECTRIC CORP66 citations96
US6181009B1Jan 30, 2001

Electronic component with a lead frame and insulating coating

MITSUBISHI ELECTRIC CORP28 citations96
US6358778B1Mar 19, 2002

Semiconductor package comprising lead frame with punched parts for terminals

MITSUBISHI ELECTRIC CORP34 citations93
US6084292AJul 4, 2000

Lead frame and semiconductor device using the lead frame

MITSUBISHI ELECTRIC CORP49 citations93
US4942455AJul 17, 1990

Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame

MITSUBISHI ELECTRIC CORP26 citations93
US7656016B2Feb 2, 2010

Power semiconductor device

MITSUBISHI ELECTRIC CORP38 citations92
US6787900B2Sep 7, 2004

Semiconductor module and insulating substrate thereof

MITSUBISHI ELECTRIC CORP43 citations92
USD421969SMar 28, 2000

Semiconductor device

MITSUBISHI ELECTRIC CORP36 citations92
USD418485SJan 4, 2000

Semiconductor device

MITSUBISHI ELECTRIC CORP26 citations92
US7848104B2Dec 7, 2010

Power module

MITSUBISHI ELECTRIC CORP14 citations84
US7742269B2Jun 22, 2010

Circuit breaker

MITSUBISHI ELECTRIC CORP8 citations84
US7642640B2Jan 5, 2010

Semiconductor device and manufacturing process thereof

MITSUBISHI ELECTRIC CORP8 citations84
US7045907B2May 16, 2006

Semiconductor device and method of manufacturing same

MITSUBISHI ELECTRIC CORP13 citations84
USD428859SAug 1, 2000

Semiconductor device

MITSUBISHI ELECTRIC CORP16 citations84
US6087201AJul 11, 2000

Method of manufacturing ball grid array electronic component

MITSUBISHI ELECTRIC CORP13 citations82
US5900671AMay 4, 1999

Electronic component including conductor connected to electrode and anodically bonded to insulating coating

MITSUBISHI ELECTRIC CORP12 citations82
US5026669AJun 25, 1991

Method of eliminating burrs on a lead frame with a thin metal coating

MITSUBISHI ELECTRIC CORP18 citations82
US6765285B2Jul 20, 2004

Power semiconductor device with high radiating efficiency

MITSUBISHI ELECTRIC CORP12 citations74
US6310395B1Oct 30, 2001

Electronic component with anodically bonded contact

MITSUBISHI ELECTRIC CORP6 citations74
US6268647B1Jul 31, 2001

Electronic component with an insulating coating

MITSUBISHI ELECTRIC CORP7 citations74
US6133069AOct 17, 2000

Method of manufacturing the electronic using the anode junction method

MITSUBISHI ELECTRIC CORP3 citations74
US5872394AFeb 16, 1999

Lead frame

MITSUBISHI ELECTRIC CORP7 citations74
US11264318B2Mar 1, 2022

Semiconductor device, method for manufacturing the same, and semiconductor module

MITSUBISHI ELECTRIC CORP0 citations63
USRE38043EMar 25, 2003

Lead frame

MITSUBISHI ELECTRIC CORP2 citations63
US7476966B2Jan 13, 2009

Semiconductor module

MITSUBISHI ELECTRIC CORP0 citations42
US10181445B2Jan 15, 2019

Power module

MITSUBISHI ELECTRIC CORP0 citations40

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

10 patents

PANASONIC IP MAN CO LTD

3 patents

PANASONIC I PRO SENSING SOLUTIONS CO LTD

2 patents

OTA TATSUO

2 patents

TERUMO CORP

2 patents

THK CO LTD

1 patent

TERAI MAMORU

1 patent