Inventor

BIECK DIPL-ING FLORIAN

DE2 patents

Patents

2 patents

US7880179B2Feb 1, 2011

Process for making contact with and housing integrated circuits

WAFER LEVEL PACKAGING PORTFOLIO LLC4 citations68

US8349707B2Jan 8, 2013

Process for making contact with and housing integrated circuits

WAFER LEVEL PACKAGING PORTFOLIO LLC3 citations57