Inventor
WEI CONG
US21 patents
⚠️ This page may combine multiple inventors who share the name “WEI CONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS6126848AOct 3, 2000
Indirect endpoint detection by chemical reaction and chemiluminescence
IBM485 citations97
US6276987B1Aug 21, 2001
Chemical mechanical polishing endpoint process control
IBM32 citations92
US6228280B1May 8, 2001
Endpoint detection by chemical reaction and reagent
IBM51 citations92
US6254453B1Jul 3, 2001
Optimization of chemical mechanical process by detection of oxide/nitride interface using CLD system
IBM17 citations83
US6878629B1Apr 12, 2005
Method for detecting CMP endpoint in acidic slurries
IBM8 citations73
US6261851B1Jul 17, 2001
Optimization of CMP process by detecting of oxide/nitride interface using IR system
IBM12 citations73
US6228769B1May 8, 2001
Endpoint detection by chemical reaction and photoionization
IBM8 citations73
US6180422B1Jan 30, 2001
Endpoint detection by chemical reaction
IBM5 citations73
US6066564AMay 23, 2000
Indirect endpoint detection by chemical reaction
IBM12 citations73
US6440263B1Aug 27, 2002
Indirect endpoint detection by chemical reaction and chemiluminescence
IBM8 citations72
US6506341B2Jan 14, 2003
Chemiluminescence detection apparatus
IBM6 citations69
US6021679AFeb 8, 2000
Probe for slurry gas sampling
IBM11 citations69
US6419785B1Jul 16, 2002
Endpoint detection by chemical reaction
IBM2 citations62
US6194230B1Feb 27, 2001
Endpoint detection by chemical reaction and light scattering
IBM5 citations62
US6251784B1Jun 26, 2001
Real-time control of chemical-mechanical polishing processing by monitoring ionization current
IBM3 citations61
US6291351B1Sep 18, 2001
Endpoint detection in chemical-mechanical polishing of cloisonne structures
IBM6 citations59
US6176765B1Jan 23, 2001
Accumulator for slurry sampling
IBM5 citations59