Inventor

HOANG GINA V

US2 patents

⚠️ This page may combine multiple inventors who share the name “HOANG GINA V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HENKEL AG & CO KGAA

1 patent

US12187843B2Jan 7, 2025

Liquid compression molding or encapsulant compositions

HENKEL AG & CO KGAA0 citations50

Henkel IP & Holding GmbH

1 patent

US9449938B2Sep 20, 2016

Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof

Henkel IP & Holding GmbH0 citations24