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Inventor
MAHER STEVEN P
US
2 patents
Patents
2 patents
US6159754A
Dec 12, 2000
Method of making a circuit edit interconnect structure through the backside of an integrated circuit die
INTEL CORP
21 citations
89
US6376919B1
Apr 23, 2002
Circuit edit interconnect structure through the backside of an integrated circuit die
INTEL CORP
12 citations
70