Inventor
JONES OLIVER DAVID
US23 patents
⚠️ This page may combine multiple inventors who share the name “JONES OLIVER DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
20 patentsUS6213136B1Apr 10, 2001
Robot end-effector cleaner and dryer
LAM RES CORP39 citations96
US6024107AFeb 15, 2000
Apparatus for cleaning robot end effector
LAM RES CORP36 citations96
US6012470AJan 11, 2000
Method of drying a wafer
LAM RES CORP45 citations96
US6457199B1Oct 1, 2002
Substrate processing in an immersion, scrub and dry system
LAM RES CORP64 citations95
US6625835B1Sep 30, 2003
Disk cascade scrubber
LAM RES CORP64 citations94
US6482678B1Nov 19, 2002
Wafer preparation systems and methods for preparing wafers
LAM RES CORP29 citations92
US6637446B2Oct 28, 2003
Integrated substrate processing system
LAM RES CORP44 citations91
US6588043B1Jul 8, 2003
Wafer cascade scrubber
LAM RES CORP36 citations91
US6615510B2Sep 9, 2003
Wafer drying apparatus and method
LAM RES CORP15 citations90
US6446355B1Sep 10, 2002
Disk drying apparatus and method
LAM RES CORP16 citations90
US6430841B1Aug 13, 2002
Apparatus for drying batches of wafers
LAM RES CORP15 citations90
US6427566B1Aug 6, 2002
Self-aligning cylindrical mandrel assembly and wafer preparation apparatus including the same
LAM RES CORP30 citations90
US6328640B1Dec 11, 2001
Wafer preparation apparatus including rotatable wafer preparation assemblies
LAM RES CORP23 citations90
US6230753B1May 15, 2001
Wafer cleaning apparatus
LAM RES CORP27 citations90
US6345404B1Feb 12, 2002
Wafer cleaning apparatus
LAM RES CORP23 citations89
US6143089ANov 7, 2000
Method of cleaning semiconductor wafers and other substrates
LAM RES CORP27 citations89
US6616509B1Sep 9, 2003
Method for performing two wafer preparation operations on vertically oriented semiconductor wafer in single enclosure
LAM RES CORP18 citations83
US6368192B1Apr 9, 2002
Wafer preparation apparatus including variable height wafer drive assembly
LAM RES CORP16 citations82
US6461224B1Oct 8, 2002
Off-diameter method for preparing semiconductor wafers
LAM RES CORP12 citations73
US6477786B1Nov 12, 2002
Apparatus for drying batches of disks
LAM RES CORP9 citations71