Inventor
STUEMPFL CHRISTIAN
DE24 patents
⚠️ This page may combine multiple inventors who share the name “STUEMPFL CHRISTIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
22 patentsUS7683460B2Mar 23, 2010
Module with a shielding and/or heat dissipating element
INFINEON TECHNOLOGIES AG54 citations97
US6902951B2Jun 7, 2005
Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device
INFINEON TECHNOLOGIES AG67 citations97
US7456495B2Nov 25, 2008
Semiconductor module with a semiconductor stack, and methods for its production
INFINEON TECHNOLOGIES AG79 citations95
US6710455B2Mar 23, 2004
Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component
INFINEON TECHNOLOGIES AG65 citations95
US7276783B2Oct 2, 2007
Electronic component with a plastic package and method for production
INFINEON TECHNOLOGIES AG54 citations92
US6867471B2Mar 15, 2005
Universal package for an electronic component with a semiconductor chip and method for producing the universal package
INFINEON TECHNOLOGIES AG33 citations92
US6683374B2Jan 27, 2004
Electronic component and process for producing the electronic component
INFINEON TECHNOLOGIES AG30 citations92
US7944061B2May 17, 2011
Semiconductor device having through contacts through a plastic housing composition and method for the production thereof
INFINEON TECHNOLOGIES AG10 citations84
US7714416B2May 11, 2010
Electronic circuit in a package-in-package configuration and production method
INFINEON TECHNOLOGIES AG8 citations84
US7517722B2Apr 14, 2009
Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds
INFINEON TECHNOLOGIES AG13 citations84
US7666777B2Feb 23, 2010
Electronic structure with components connected by way of solderable connecting elements and method
INFINEON TECHNOLOGIES AG7 citations74
US9881909B2Jan 30, 2018
Method for attaching a semiconductor die to a carrier
INFINEON TECHNOLOGIES AG4 citations73
US10651109B2May 12, 2020
Selective plating of semiconductor package leads
INFINEON TECHNOLOGIES AG2 citations65
US7547645B2Jun 16, 2009
Method for coating a structure comprising semiconductor chips
INFINEON TECHNOLOGIES AG2 citations62
US9576935B2Feb 21, 2017
Method for fabricating a semiconductor package and semiconductor package
INFINEON TECHNOLOGIES AG0 citations52
US7919857B2Apr 5, 2011
Plastic housing and semiconductor component with said plastic housing
INFINEON TECHNOLOGIES AG0 citations52
US7834460B2Nov 16, 2010
Method for manufacturing an electronic component and corresponding electronic component
INFINEON TECHNOLOGIES AG0 citations52
US7749864B2Jul 6, 2010
Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
INFINEON TECHNOLOGIES AG0 citations52
US7592236B2Sep 22, 2009
Method for applying a structure of joining material to the back surfaces of semiconductor chips
INFINEON TECHNOLOGIES AG0 citations52
US7294916B2Nov 13, 2007
Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
INFINEON TECHNOLOGIES AG0 citations52
US6953992B2Oct 11, 2005
Electronic component with at least one semiconductor chip and method for its manufacture
INFINEON TECHNOLOGIES AG1 citations51
US7662664B2Feb 16, 2010
Electronic circuit in a package-on-package configuration and method for producing the same
INFINEON TECHNOLOGIES AG0 citations41