Inventor
WEIN STEFAN
DE7 patents
Patents
7 patentsUS6902951B2Jun 7, 2005
Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device
INFINEON TECHNOLOGIES AG67 citations97
US6710455B2Mar 23, 2004
Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component
INFINEON TECHNOLOGIES AG65 citations95
US7276783B2Oct 2, 2007
Electronic component with a plastic package and method for production
INFINEON TECHNOLOGIES AG54 citations92
US6867471B2Mar 15, 2005
Universal package for an electronic component with a semiconductor chip and method for producing the universal package
INFINEON TECHNOLOGIES AG33 citations92
US6683374B2Jan 27, 2004
Electronic component and process for producing the electronic component
INFINEON TECHNOLOGIES AG30 citations92
US7517722B2Apr 14, 2009
Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds
INFINEON TECHNOLOGIES AG13 citations84
US6953992B2Oct 11, 2005
Electronic component with at least one semiconductor chip and method for its manufacture
INFINEON TECHNOLOGIES AG1 citations51