Inventor
SHIRAISHI TSUKASA
JP20 patents
⚠️ This page may combine multiple inventors who share the name “SHIRAISHI TSUKASA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
12 patentsUS5920142AJul 6, 1999
Electronic part and a method of production thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD206 citations99
US6154940ADec 5, 2000
Electronic part and a method of production thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD93 citations98
US6756663B2Jun 29, 2004
Semiconductor device including wiring board with three dimensional wiring pattern
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD91 citations97
US6525414B2Feb 25, 2003
Semiconductor device including a wiring board and semiconductor elements mounted thereon
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD88 citations97
US6300576B1Oct 9, 2001
Printed-circuit board having projection electrodes and method for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD74 citations96
US6909180B2Jun 21, 2005
Semiconductor device, mounting circuit board, method of producing the same, and method of producing mounting structure using the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD36 citations92
US6694613B2Feb 24, 2004
Method for producing a printed-circuit board having projection electrodes
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations92
US6452280B1Sep 17, 2002
Flip chip semiconductor apparatus with projecting electrodes and method for producing same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD17 citations84
US6429382B1Aug 6, 2002
Electrical mounting structure having an elution preventive film
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations83
US6369450B1Apr 9, 2002
Method of producing mounting structure and mounting structure produced by the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations57
US6284640B1Sep 4, 2001
Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD0 citations52
US6818461B2Nov 16, 2004
Method of producing mounting structure and mounting structure produced by the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1 citations51
PANASONIC CORP
6 patentsUS9076752B2Jul 7, 2015
Semiconductor device and method for manufacturing the same
PANASONIC CORP4 citations71
US7850803B2Dec 14, 2010
Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film
PANASONIC CORP3 citations63
US7752749B2Jul 13, 2010
Electronic component mounting method and electronic component mounting device
PANASONIC CORP2 citations62
US7649267B2Jan 19, 2010
Package equipped with semiconductor chip and method for producing same
PANASONIC CORP2 citations59
US7963310B2Jun 21, 2011
Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film
PANASONIC CORP0 citations52
US8353102B2Jan 15, 2013
Wiring board connection method
PANASONIC CORP1 citations51