Inventor

BESSHO YOSHIHIRO

JP51 patents

Patents

50 patents

US6372548B2Apr 16, 2002

Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD170 citations99

US6229209B1May 8, 2001

Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD159 citations99

US7134198B2Nov 14, 2006

Method for manufacturing electric element built-in module with sealed electric element

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD113 citations98

US6798121B2Sep 28, 2004

Module with built-in electronic elements and method of manufacture thereof

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD80 citations98

US6154940ADec 5, 2000

Electronic part and a method of production thereof

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD93 citations98

US5090119AFeb 25, 1992

Method of forming an electrical contact bump

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD178 citations98

US5014111AMay 7, 1991

Electrical contact bump and a package provided with the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD138 citations98

US6756663B2Jun 29, 2004

Semiconductor device including wiring board with three dimensional wiring pattern

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD91 citations97

US6525414B2Feb 25, 2003

Semiconductor device including a wiring board and semiconductor elements mounted thereon

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD88 citations97

US5641996AJun 24, 1997

Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD190 citations97

US6518514B2Feb 11, 2003

Circuit board and production of the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD48 citations96

US6300576B1Oct 9, 2001

Printed-circuit board having projection electrodes and method for producing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD74 citations96

US6103551AAug 15, 2000

Semiconductor unit and method for manufacturing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD51 citations96

US5844320ADec 1, 1998

Semiconductor unit with semiconductor device mounted with conductive adhesive

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD78 citations96

US5670826ASep 23, 1997

Method for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD55 citations96

US5640051AJun 17, 1997

Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD74 citations96

US5547530AAug 20, 1996

Method of manufacturing a ceramic substrate

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD46 citations96

US5545589AAug 13, 1996

Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD101 citations96

US6372547B2Apr 16, 2002

Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD30 citations93

US6365499B1Apr 2, 2002

Chip carrier and method of manufacturing and mounting the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD29 citations93

US5940679AAug 17, 1999

Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD49 citations93

US5651179AJul 29, 1997

Method for mounting a semiconductor device on a circuit board

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD34 citations93

US6774316B1Aug 10, 2004

Wiring board and production method thereof

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD50 citations92

US6694613B2Feb 24, 2004

Method for producing a printed-circuit board having projection electrodes

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations92

US6691409B2Feb 17, 2004

Method of producing a circuit board

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD40 citations92

US6465082B1Oct 15, 2002

Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD31 citations92

US6207550B1Mar 27, 2001

Method for fabricating bump electrodes with a leveling step for uniform heights

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD30 citations92

US5688441ANov 18, 1997

Thixotropic conductive paste

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD20 citations92

US5628919AMay 13, 1997

Methods for producing a chip carrier and terminal electrode for a circuit substrate

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD40 citations92

US5525402AJun 11, 1996

Ceramic substrate and manufacturing method thereof

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD27 citations92

US5503777AApr 2, 1996

Thixotropic conductive paste

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD30 citations92

US5496619AMar 5, 1996

Assembly formed from conductive paste and insulating paste

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD36 citations92

US6710682B2Mar 23, 2004

Surface acoustic wave device, method for producing the same, and circuit module using the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD43 citations91

US6452280B1Sep 17, 2002

Flip chip semiconductor apparatus with projecting electrodes and method for producing same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD17 citations84

US6429382B1Aug 6, 2002

Electrical mounting structure having an elution preventive film

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD16 citations83

US5407473AApr 18, 1995

Conductive ink

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations82

US6749889B2Jun 15, 2004

Method for producing mounting structure for an electronic component

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations74

US6538315B2Mar 25, 2003

Semiconductor device and method of manufacturing same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations74

US6488869B2Dec 3, 2002

Conductive paste, its manufacturing method, and printed wiring board using the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8 citations74

US5662755ASep 2, 1997

Method of making multi-layered ceramic substrates

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12 citations74

US6310393B1Oct 30, 2001

Electric circuit and package for semiconductor

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD12 citations73

US6603207B2Aug 5, 2003

Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations63

US6569512B2May 27, 2003

Mounting structure for an electronic component and method for producing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations63

US6387794B2May 14, 2002

Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations63

US6376051B1Apr 23, 2002

Mounting structure for an electronic component and method for producing the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations63

US6369450B1Apr 9, 2002

Method of producing mounting structure and mounting structure produced by the same

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations57

US6284640B1Sep 4, 2001

Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor device

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD0 citations52

Showing the top 50 of 51 patents by PatentIndex Score.

BESSHO YOSHIHIRO

Patents

Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate

Chip carrier

Semiconductor device having a bump having a rugged side

Electronic part and a method of production thereof

Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary

Method for manufacturing electric element built-in module with sealed electric element

Module with built-in electronic elements and method of manufacture thereof

Electronic part and a method of production thereof

Method of forming an electrical contact bump

Electrical contact bump and a package provided with the same

Semiconductor device including wiring board with three dimensional wiring pattern

Semiconductor device including a wiring board and semiconductor elements mounted thereon

Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

Circuit board and production of the same

Printed-circuit board having projection electrodes and method for producing the same

Semiconductor unit and method for manufacturing the same

Semiconductor unit with semiconductor device mounted with conductive adhesive

Method for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the method

Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex

Method of manufacturing a ceramic substrate

Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device

Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board

Chip carrier and method of manufacturing and mounting the same

Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage

Method for mounting a semiconductor device on a circuit board

Wiring board and production method thereof

Method for producing a printed-circuit board having projection electrodes

Method of producing a circuit board

Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body

Method for fabricating bump electrodes with a leveling step for uniform heights

Thixotropic conductive paste

Methods for producing a chip carrier and terminal electrode for a circuit substrate

Ceramic substrate and manufacturing method thereof

Thixotropic conductive paste

Assembly formed from conductive paste and insulating paste

Surface acoustic wave device, method for producing the same, and circuit module using the same

Flip chip semiconductor apparatus with projecting electrodes and method for producing same

Electrical mounting structure having an elution preventive film

Conductive ink

Method for producing mounting structure for an electronic component

Semiconductor device and method of manufacturing same

Conductive paste, its manufacturing method, and printed wiring board using the same

Method of making multi-layered ceramic substrates

Electric circuit and package for semiconductor

Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device

Mounting structure for an electronic component and method for producing the same

Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device

Mounting structure for an electronic component and method for producing the same

Method of producing mounting structure and mounting structure produced by the same

Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor device