Inventor
BRINTZINGER AXEL
DE26 patents
⚠️ This page may combine multiple inventors who share the name “BRINTZINGER AXEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
19 patentsUS6433404B1Aug 13, 2002
Electrical fuses for semiconductor devices
INFINEON TECHNOLOGIES AG113 citations95
US6943101B2Sep 13, 2005
Manufacturing of a corrosion protected interconnect on a substrate
INFINEON TECHNOLOGIES AG22 citations92
US6638870B2Oct 28, 2003
Forming a structure on a wafer
INFINEON TECHNOLOGIES AG22 citations92
US6465282B1Oct 15, 2002
Method of forming a self-aligned antifuse link
INFINEON TECHNOLOGIES AG35 citations92
US6458631B1Oct 1, 2002
Method for fabricating an integrated circuit, in particular an antifuse
INFINEON TECHNOLOGIES AG17 citations83
US7115496B2Oct 3, 2006
Method for protecting the redistribution layer on wafers/chips
INFINEON TECHNOLOGIES AG8 citations72
US6919264B2Jul 19, 2005
Method for the solder-stop structuring of elevations on wafers
INFINEON TECHNOLOGIES AG11 citations70
US6866943B2Mar 15, 2005
Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level
INFINEON TECHNOLOGIES AG10 citations69
US6911390B2Jun 28, 2005
Fabrication method for an interconnect on a substrate
INFINEON TECHNOLOGIES AG2 citations63
US7271095B2Sep 18, 2007
Process for producing metallic interconnects and contact surfaces on electronic components
INFINEON TECHNOLOGIES AG2 citations61
US7368375B2May 6, 2008
Electronic component with compliant elevations having electrical contact areas and method for producing it
INFINEON TECHNOLOGIES AG2 citations60
US7169647B2Jan 30, 2007
Connection between a semiconductor chip and an external conductor structure and method for producing it
INFINEON TECHNOLOGIES AG2 citations60
US7393782B2Jul 1, 2008
Process for producing layer structures for signal distribution
INFINEON TECHNOLOGIES AG3 citations59
US7332430B2Feb 19, 2008
Method for improving the mechanical properties of BOC module arrangements
INFINEON TECHNOLOGIES AG0 citations51
US7335591B2Feb 26, 2008
Method for forming three-dimensional structures on a substrate
INFINEON TECHNOLOGIES AG1 citations50
US7235859B2Jun 26, 2007
Arrangement and process for protecting fuses/anti-fuses
INFINEON TECHNOLOGIES AG1 citations49
US7390742B2Jun 24, 2008
Method for producing a rewiring printed circuit board
INFINEON TECHNOLOGIES AG1 citations47
US7514798B2Apr 7, 2009
Arrangement for the protection of three-dimensional structures on wafers
INFINEON TECHNOLOGIES AG0 citations42
US7172966B2Feb 6, 2007
Method for fabricating metallic interconnects on electronic components
INFINEON TECHNOLOGIES AG0 citations38
IBM
3 patentsUS6882027B2Apr 19, 2005
Methods and apparatus for providing an antifuse function
IBM33 citations92
US6288436B1Sep 11, 2001
Mixed fuse technologies
IBM31 citations90
US6436585B1Aug 20, 2002
Method of using optical proximity effects to create electrically blown fuses with sub-critical dimension neck downs
IBM8 citations70