Inventor · disambiguated record

Wai B. Fu

Also filed as: FU WAI B

1 granted patent·2 citations·filing 2005–2005

19Inventor score

Technology areasC25D

Files withHITACHI GLOBAL STORAGE TECH NL1

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1 record

0171US7914657B2Controlling the thickness of wafers during the electroplating processHITACHI GLOBAL STORAGE TECH NL·Filed 2005·Granted Mar 29, 2011·2 cites·21 claims

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Wai B. Fu — Patent Inventor | PatentIndex