Inventor
WILLIAMS VERNON M
US28 patents
Patents
28 patentsUS7323767B2Jan 29, 2008
Standoffs for centralizing internals in packaging process
MICRON TECHNOLOGY INC121 citations99
US6558600B1May 6, 2003
Method for packaging microelectronic substrates
MICRON TECHNOLOGY INC75 citations98
US6468891B2Oct 22, 2002
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
MICRON TECHNOLOGY INC76 citations97
US6764933B2Jul 20, 2004
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
MICRON TECHNOLOGY INC25 citations96
US6632732B2Oct 14, 2003
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
MICRON TECHNOLOGY INC38 citations96
US6500746B2Dec 31, 2002
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
MICRON TECHNOLOGY INC42 citations96
US7557452B1Jul 7, 2009
Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same
MICRON TECHNOLOGY INC43 citations93
US6730998B1May 4, 2004
Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same
MICRON TECHNOLOGY INC24 citations93
US6780744B2Aug 24, 2004
Stereolithographic methods for securing conductive elements to contacts of semiconductor device components
MICRON TECHNOLOGY INC18 citations92
US6767815B2Jul 27, 2004
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
MICRON TECHNOLOGY INC18 citations92
US6764935B2Jul 20, 2004
Stereolithographic methods for fabricating conductive elements
MICRON TECHNOLOGY INC17 citations92
US6602430B1Aug 5, 2003
Methods for finishing microelectronic device packages
MICRON TECHNOLOGY INC20 citations88
US7459797B2Dec 2, 2008
Standoffs for centralizing internals in packaging process
MICRON TECHNOLOGY INC9 citations84
US6815253B2Nov 9, 2004
Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
MICRON TECHNOLOGY INC8 citations82
US7137193B2Nov 21, 2006
Programmed material consolidation methods for fabricating printed circuit board
MICRON TECHNOLOGY INC4 citations74
US6863516B2Mar 8, 2005
Transfer molding and underfilling apparatus
MICRON TECHNOLOGY INC10 citations74
US6838319B1Jan 4, 2005
Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially vertically
MICRON TECHNOLOGY INC7 citations74
US6830954B2Dec 14, 2004
Transfer molding and underfilling method and apparatus
MICRON TECHNOLOGY INC5 citations74
US7501309B2Mar 10, 2009
Standoffs for centralizing internals in packaging process
MICRON TECHNOLOGY INC1 citations63
US7462510B2Dec 9, 2008
Standoffs for centralizing internals in packaging process
MICRON TECHNOLOGY INC3 citations63
US7239015B2Jul 3, 2007
Heat sinks including nonlinear passageways
MICRON TECHNOLOGY INC1 citations63
US7205654B2Apr 17, 2007
Programmed material consolidation methods for fabricating heat sinks
MICRON TECHNOLOGY INC1 citations63
US6977211B2Dec 20, 2005
Selective consolidation processes for electrically connecting contacts of semiconductor device components
MICRON TECHNOLOGY INC1 citations63
US7264456B2Sep 4, 2007
Leadframe and method for reducing mold compound adhesion problems
MICRON TECHNOLOGY INC2 citations58
US6666997B2Dec 23, 2003
Method for removing cleaning compound flash from mold vents
MICRON TECHNOLOGY INC3 citations58
US7273802B2Sep 25, 2007
Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads
MICRON TECHNOLOGY INC0 citations52
US7026191B2Apr 11, 2006
Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same
MICRON TECHNOLOGY INC0 citations52
US7029256B2Apr 18, 2006
Leadframe and method for removing cleaning compound flash from mold vents
MICRON TECHNOLOGY INC0 citations48