Inventor

BERGMANN MICHAEL JOHN

US101 patents

⚠️ This page may combine multiple inventors who share the name “BERGMANN MICHAEL JOHN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BERGMANN MICHAEL JOHN

CREE INC

Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures

Light emitting devices with active layers that extend into opened pits

Group III nitride LED with undoped cladding layer and multiple quantum well

LED lamp

Group III nitride based quantum well light emitting device structures with an indium containing capping structure

Methods of forming light emitting devices with active layers that extend into opened pits

Group III nitride based superlattice structures

Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures

Ultraviolet light emitting diode

Indium gallium nitride-based ohmic contact layers for gallium nitride-based devices

Ultraviolet light emitting diode

LED chip

Inverted light emitting diode on conductive substrate

Group III nitride LED with undoped cladding layer (5000.137)

Group III nitride light emitting devices with gallium-free layers

Solid-state lamp with LED filaments having different CCT&#39;s

Group III nitride based quantum well light emitting device structures with an indium containing capping structure

Group III nitride LED with undoped cladding layer

Group III nitride LED with silicon carbide substrate

Group III nitride contact structures for light emitting devices

Light emitting devices with Group III nitride contact layer and superlattice

LED package with encapsulant having curved and planar surfaces

Solid state light fixtures suitable for high temperature operation having separate blue-shifted-yellow/green and blue-shifted-red emitters

Wafer level packaging of multiple light emitting diodes (LEDs) on a single carrier die

LED package

LED chip

Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads

LED chip

LED chip

LED chip

High voltage monolithic LED chip

LED package with encapsulant

Solid state light fixtures suitable for high temperature operation having separate blue-shifted-yellow/green and blue-shifted-red emitters

Restricted radiated heating assembly for high temperature processing

LED chip

Group III nitride LED with silicon carbide cladding layer

Small form-factor LED lamp with color-controlled dimming

LED package

LED package

High efficacy semiconductor light emitting devices employing remote phosphor configurations

LED package with truncated encapsulant

BERGMANN MICHAEL JOHN

Wafer level packaging of light emitting diodes (LEDs)

Group III nitride based light emitting diode structures with multiple quantum well structures having varying well thicknesses

Low temperature high strength metal stack for die attachment

KNOW BIO LLC

Illumination devices for inducing biological effects

Oral illumination device

Oral illumination device

EMERSON DAVID TODD

Methods of forming light emitting devices having current reducing structures

Methods of fabricating group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures

CHITNIS ASHAY

Emission tuning methods and devices fabricated utilizing methods

Solid-state lamp with LED filaments having different CCT's