Inventor
Doepke Holger
DE5 patents
Patents
5 patentsUS10043782B2Aug 7, 2018
Electronic device package having a dielectric layer and an encapsulant
INFINEON TECHNOLOGIES AG5 citations71
US10332814B2Jun 25, 2019
Bonded system and a method for adhesively bonding a hygroscopic material
INFINEON TECHNOLOGIES AG2 citations68
US10600690B2Mar 24, 2020
Method for handling a product substrate and a bonded substrate system
INFINEON TECHNOLOGIES AG0 citations50
US10056295B2Aug 21, 2018
Method for handling a product substrate, a bonded substrate system and a temporary adhesive
INFINEON TECHNOLOGIES AG0 citations50
US11804432B2Oct 31, 2023
Semiconductor device with polymer-based insulating material and method of producing thereof
INFINEON TECHNOLOGIES AG0 citations48