Inventor

CHAN LO KWAN

HK2 patents

Patents

2 patents

US4603803AAug 5, 1986

Wire bonding apparatus

ASM ASSEMBLY AUTOMATION LTD62 citations88

US4606490AAug 19, 1986

Apparatus and method for automatic evaluation of a bond created by an ultrasonic transducer

ASM ASSEMBLY AUTOMATION LTD27 citations84